Device and method for disassembling plug-in mounted components of waste printed circuit board

Abstract

The invention discloses a device and method for disassembling plug-in mounted components of a waste printed circuit board, belonging to the technical field of production, maintenance and waste recycle. The device comprises a surface-grinding machine, a fixture and a dust collector, wherein the fixture is fixedly connected to an operating platform of the surface-grinding machine and is of a position self-adaptive spring device structure, circuit board component pins to be disassembled are clamped on the fixture upwards, a grinding wheel of the surface-grinding machine is in grinding contact with the circuit board component pins, the dust collector is fixed in front of a rotating direction of the grinding wheel, and the surface-grinding machine is a general surface-grinding machine. The plug-in mounted components on the waste printed circuit board are disassembled on the basis of the grinding on the component pins of the waste printed circuit board, thus the invention has a self-adaptive position regulating function, ensures that the component pins are ground reliability in a disassembling process, avoids high-temperature heating and external force holding to the components, realizes high plug-in mounted component disassembling rate, and is suitable for the waste recycling enterprise in the electronics industry.

Description

technical field [0001] The invention belongs to the technical field of production, maintenance and recycling of waste products, and in particular relates to a device and method for dismantling plug-in components of waste printed circuit boards. Background technique [0002] Printed Circuit Board (PCB for short, or Printed Wiring Board, PWB for short) is an important part of electronic information products, household electrical appliances, etc. A printed circuit board is usually a component that is soldered by low-temperature soldering to an insulating substrate printed with electrically connected conductive patterns and several components. Most of the substrates are flame-retardant phenolic paper-based copper-clad laminates, non-flame-retardant phenolic paper-based copper-clad laminates or epoxy glass fiber cloth-based core boards. Components are usually divided into SMD components (SMD) and plug-in components (THD) according to the installation method, including various in...

AI Technical Summary

Problems solved by technology

If the circuit board is deformed by force, some pins far away from the blade are not easy to remove completely

[0010] Patent JP3579605B2 uses a laser position sensor to measure the distance between the tool and the circuit board on the basis of the pin cutting method, and automatically adjusts the height of the tool to adapt to the deformation of the circuit board. The equipment cost of this method is too high

[0011] Japanese patent JP1998209634 uses abrasive belt grinding to remove the pins of waste circuit boards. This method cannot achieve uniform grinding when the waste circuit boards are warped and deformed, and the area size of the ground circuit boards Restricted

Images