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Silver conductive adhesive and preparation method thereof

A technology of conductive silver glue and conductive material, used in conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of high volume resistance, limited application range, low viscosity and strength of conductive silver glue, and achieve low expansion. efficiency, low volume resistance

Inactive Publication Date: 2011-05-04
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is that the existing conductive silver glue has the defects of low viscosity strength, high volume resistance and limited application range, so as to provide a conductive silver glue with high conductivity, low volume resistance and wide application and its preparation method

Method used

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  • Silver conductive adhesive and preparation method thereof
  • Silver conductive adhesive and preparation method thereof
  • Silver conductive adhesive and preparation method thereof

Examples

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preparation example Construction

[0012] According to the preparation method of the conductive silver paste provided by the present invention, the γ-butyrolactone modified epoxy resin is obtained by transesterifying γ-butyrolactone and epoxy resin. The epoxy resin is a liquid at normal temperature, preferably a low viscosity liquid, such as E51, E54, E56. The structural formula of described γ-butyrolactone modified epoxy resin is as follows:

[0013]

[0014] Wherein, R is not limited and can be determined according to the selected epoxy resin.

[0015] Conductive silver glue provided by the invention, preferably, the content of each component is:

[0016]

[0017] According to the conductive silver glue provided by the present invention, in order to make the conductive silver glue have better adhesion, preferably, the epoxy equivalent of the bisphenol A epoxy resin is 150-300, more preferably 200-250.

[0018] According to the conductive silver paste provided by the present invention, preferably, the ...

Embodiment 1

[0031] Add 100 parts of γ-butyrolactone and 2.5 parts of BF3OEt2 (boron trifluoride ether) to 600 parts of toluene to prepare solution 1; add 100 parts of epoxy resin E54 to 150 parts of toluene to prepare solution 2; Keep the temperature of solution 1 at -5°C in a salt bath, add solution 2 dropwise to solution 1 within 12 hours, add 6.5 parts of triethylamine to obtain solution 3; wash solution 3 with 8% sodium hydroxide solution 3 times, and then washed to neutral with deionized water to obtain solution 4; solution 4 was distilled under reduced pressure and then vacuum-dried to obtain modified epoxy resin A1.

Embodiment 2

[0033] Add 100 parts of γ-butyrolactone and 2.5 parts of BF3OEt2 (boron trifluoride ether) to 600 parts of toluene to prepare solution 1; add 100 parts of epoxy resin E51 to 150 parts of toluene to prepare solution 2; Keep the temperature of solution 1 in a salt bath at -1°C, add the solution dropwise to solution 1 within 12 hours, add 6.5 parts of triethylamine to obtain solution 3; wash solution 3 with 8% sodium hydroxide solution 3 and then washed with deionized water until neutral to obtain solution 4; after decompression distillation solution 4 was vacuum-dried to obtain modified epoxy resin A2.

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Abstract

The invention provides a silver conductive adhesive, comprising a basic resin, a curing agent, a curing accelerator, a conductive material and a solvent, wherein the basic resin is an epoxy resin including a bisphenol A epoxy resin and a gamma-butyrolactone modified epoxy resin, the curing agent is binary aliphatic ether amine and versamid, the curing accelerator is 2,4,6-tri-(dimethylaminomethyl)-phenol, and the conductive material is silver powder. The invention further provides a preparation method of the silver conductive adhesive. In the invention, the gamma-butyrolactone modified epoxy resin is introduced into the epoxy system silver conductive adhesive, and when the modified epoxy resin is cured, a polycyclic structure is subjected to ring-opening polymerization to result in volumetric expansion, by jointly applying the modified epoxy resin and the epoxy resin to the silver conductive adhesive, the prepared silver conductive adhesive has low shrinkage rate and low expansion rate as well as low volume resistance. The silver conductive adhesive prepared in the invention can be widely applied to various environments.

Description

technical field [0001] The invention relates to a conductive silver glue and a preparation method thereof, belonging to the field of electronic materials. Background technique [0002] Conductive silver glue is widely used in electronics, information, electroplating and other industries, and is mainly used for conductive bonding between objects. Conductive silver adhesives usually use epoxy resin or polyurethane as the matrix resin of conductive silver adhesives, add flexible macromolecules such as rubber, and use long-chain flexible amines as curing agents to improve the brittleness of epoxy resins to obtain flexible and elastic conductive silver adhesives. [0003] The current conductive silver glue will more or less shrink in volume as the curing reaction proceeds. One of the important reasons is that the distance between liquid monomer molecules is the distance of van der Waals force, while the distance between structural units in polymers is the distance of covalent bo...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/00C09J9/02C09J11/06C08G59/16
Inventor 金启明吴波
Owner BYD CO LTD
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