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Light-emitting diode and preparation method thereof

A technology of light-emitting diodes and light-emitting layers, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve the problems of increasing the bonding degree between the light-emitting layer and the chip, and easy precipitation of phosphor powder

Inactive Publication Date: 2010-12-15
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is how to provide a light-emitting diode and its preparation method. This solution solves the problems of colloid solidification and phosphor easy to precipitate in the colloid in the process of coating phosphor powder, and improves the glue output during the dispensing process. The uniformity of the light-emitting layer increases the consistency of the light-emitting layer in the light-emitting diode, increases the bonding degree between the light-emitting layer and the chip, and reduces the time required for curing the light-emitting layer; the solution is simple and effective, and can greatly reduce the production cost of the device and process difficulty, greatly improving the yield of related devices

Method used

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  • Light-emitting diode and preparation method thereof
  • Light-emitting diode and preparation method thereof
  • Light-emitting diode and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0192] Such as figure 2 In the device structure shown, the LED chip 3 is a blue LED chip, the light-emitting layer 5 is a mixed system of fluorescent powder excited by blue light to produce yellow light and an adhesive that requires double curing, and the bracket 1 is a copper bracket with silver-plated surface.

[0193] The preparation method is as follows:

[0194] ①Choose a suitable die-bonding glue to glue the blue LED chip on the bracket;

[0195] ② Lead out the electrodes on the LED chip;

[0196] ③The luminescent layer material is drip-coated on the LED chip. The luminescent layer is a mixed system of yellow fluorescent powder and an adhesive that requires double curing. The adhesive raw material includes the following components:

[0197] Acrylic resin (free radical UV curing agent) 30-40 parts

[0198] Isocyanate (thermal curing agent) 35-45 parts

[0199] Multifunctional acrylic acid (thinner) 0.2~3 parts

[0200] Photoinitiator 0.1~3 parts

[0201] Photosensi...

Embodiment 2

[0208] Such as figure 2 In the device structure shown, the LED chip 3 is a blue LED chip, the luminescent layer 5 is a mixed system of fluorescent powder excited by blue light to generate green light and an adhesive that requires double curing, and the bracket 1 is a copper bracket with a silver-plated surface.

[0209] The preparation method is as follows:

[0210] ①Choose a suitable die-bonding glue to glue the blue LED chip on the bracket;

[0211] ② Lead out the electrodes on the LED chip;

[0212] ③ Spraying the luminescent layer material on the LED chip, the luminescent layer is a mixed system of green fluorescent powder and an adhesive that requires double curing, and the adhesive raw material includes the following components:

[0213] Unsaturated polyester resin (free radical UV curing agent) 30-40 parts

[0214] Epoxy resin (heat curing agent) 35~45 parts

[0215] Multifunctional acrylic acid (thinner) 0.2~3 parts

[0216] Photoinitiator 0.1~3 parts

[0217] P...

Embodiment 3

[0224] Such as figure 2 In the device structure shown, the LED chip 3 is a blue LED chip, the luminescent layer 5 is a mixed system of phosphor powder excited by blue light to generate red light and an adhesive that requires double curing, and the bracket 1 is a copper bracket with a silver-plated surface.

[0225] The preparation method is as follows:

[0226] ①Choose a suitable die-bonding glue to glue the blue LED chip on the bracket;

[0227] ② Lead out the electrodes on the LED chip;

[0228]③ Dip-coat the luminescent layer material on the LED chip, the luminescent layer is a mixed system of red fluorescent powder and an adhesive that needs double curing, and the adhesive raw material includes the following components:

[0229] Epoxy resin (cationic UV curing agent) 35-45 parts

[0230] Amino resin (thermal curing agent) 40-45 parts

[0231] Thinner (vinyl ether monomer) 4.0~9 parts

[0232] Cationic photoinitiator (aromatic iodonium salt) 1.2~3 parts

[0233] Phot...

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Abstract

The invention discloses a light-emitting diode (LED). The LED at least comprises a bracket, an LED chip and a light-emitting layer arranged on the LED chip and is characterized in that: the light-emitting layer is a mixed system of one or more kinds of fluorescent powder capable of sending out light with various colors and an adhesive requiring double curing; and the adhesive is an adhesive of a double curing system consisting of ultraviolet curing-thermocuring, ultraviolet curing-microwave curing, ultraviolet curing-anaerobic curing or ultraviolet curing-electron beam curing. The light-emitting layer solves the problems of colloid solidification and fluorescent powder sedimentation in the process of coating the fluorescent powder, so the LED has the advantages of improving the uniformity of the fluorescent powder on the chip, enhancing the adhesive property between the light-emitting layer and the chip and shortening the curing time of the light-emitting layer.

Description

technical field [0001] The invention relates to the technical field of optoelectronic devices, in particular to a light emitting diode and a preparation method thereof. Background technique [0002] Light Emitting Diode (LED for short) is a light-emitting device that emits ultraviolet, visible or infrared light when a forward voltage is applied across a semiconductor p-n junction. It is a new generation of solid-state light source. Because of its small size, long life, low driving voltage, fast response, shock resistance, heat resistance and other characteristics, since the first light-emitting diode came out in 1964, people have not stopped the pace of research and development. With the development of light-emitting materials The development and improvement of semiconductor manufacturing process, as well as the introduction of distributed Bragg reflection structure, optical microcavity and quantum well structure in the chip growth process, have continuously improved the eff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/56
Inventor 于军胜邢国秀胡玉才蒋亚东
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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