Metal heat-conducting substrate and manufacturing method thereof

Abstract

The invention relates to the technical field of electronic packaging and discloses a metal heat-conducting substrate and a manufacturing method thereof. An insulating medium slurry layer is printed on a metal substrate and molten by a laser ablation method to form an insulating medium layer, and a metal circuit slurry layer is printed on the insulating medium layer and molten by the laser ablation method to form a metal circuit layer, so that a well-insulated radiating passage is provided. The laser melting method has the advantages of achieving extremely high pattern accuracy, contributing to product miniaturization and precision, simplifying the technology of a manufacturing process, preventing pollution, saving materials, lowering cost and achieving good radiating effect.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to a metal thermally conductive substrate and a manufacturing method thereof. Background technique [0002] Since the rise of the junction temperature during LED operation will reduce the probability of luminous recombination, the lifespan and output luminous flux will also decrease with the increase of temperature. If the heat generated by the PN junction can be dissipated as soon as possible, it will not only improve the luminous efficiency of the product, but also improve the reliability and life of the product. LED chips also have strict requirements on the matching of the linear expansion coefficient of the substrate material. [0003] At present, the more common ceramic substrates on the market are mostly LTCC (Low Temperature Co-fired Ceramic LTCC) or ceramic heat dissipation substrates made of thick film technology. The calibration bottleneck of hand-screen prin...

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Problems solved by technology

[0003] At present, the more common ceramic substrates on the market are mostly LTCC (Low Temperature Co-fired Ceramic LTCC) or ceramic heat dissipation substrates made of thick film technology. The calibration bottleneck of hand-screen printing technology for this type of products makes Its alignment accuracy cannot be matched with further soldering, such as eutectic or flip-chip packaging

[0004] It is more common in the prior art that epoxy resin is used for the insulating medium layer, and a copper circuit layer is adhered to it; the main problems are: 1. Poor thermal conductivity of epoxy resin; 2. Poor high and low temperature stability of epoxy resin; 3. The high temperature cracking of epoxy resin causes poor reliability, and the connection strength between epoxy resin and copper circuit layer and substrate is not high; 4. The process of manufacturing circuits is complex, polluting, not environmentally friendly, and unnecessary copper circuit layers need to be corroded, waste of copper resources

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