Manufacturing method of micro fluxgate sensor with amorphous magnetic core
A technology of fluxgate sensor and magnetic core, which is applied in the field of preparation of micro-electromechanical technology, can solve the problems of sensor damage, difficulty in reducing the size of fluxgate sensor, etc., and achieves avoidance of oxidation, good resistance to environmental influences, excellent The effect of mechanical properties
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Embodiment 1
[0040] (1) Sputter a Cr / Cu bottom layer on one side of the substrate (referred to as the front side), with a thickness of 80nm. Subsequent processes are all carried out on the front side;
[0041] (2) Spin-coat the positive resist, the thickness of the photoresist is 15 μm, the photoresist drying temperature is 95 ° C, and the time is 60 minutes; exposure and development, the bottom coil of the excitation coil and the induction coil and the photoresist of the positioning mark are obtained Graphics; then electroplating the bottom coil of the excitation coil and the induction coil and the positioning mark, the thickness is 15 μm, and the plating material is copper; the positive resist is spin-coated, the thickness of the photoresist is 40 μm, the photoresist drying temperature is 90 ° C, and the time is 120 minutes; exposure, development, to obtain the photoresist pattern connecting the conductor and the positioning mark; electroplating the connecting conductor and the positioni...
Embodiment 2
[0047] (1) Sputter a Cr / Cu bottom layer on one side of the substrate (referred to as the front side), with a thickness of 80nm. Subsequent processes are all carried out on the front side;
[0048] (2) Spin-coat the positive resist, the thickness of the photoresist is 20 μm, the photoresist drying temperature is 95 ° C, and the time is 60 minutes; exposure and development, the bottom coil of the excitation coil and the induction coil and the photoresist of the positioning mark are obtained Graphics; then electroplate the bottom coil of the excitation coil and the induction coil and the positioning mark, the thickness is 20 μm, and the electroplating material is copper; the positive resist is spin-coated, the thickness of the photoresist is 40 μm, the photoresist drying temperature is 90 ° C, and the time is 120 minutes; exposure, development, to obtain the photoresist pattern connecting the conductor and the positioning mark; electroplating the connecting conductor and the posi...
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