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Phenolic resin/phosphate hybrid adhesive and preparation method thereof

A technology of phenolic resin and phosphate, which is applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, epoxy resin adhesives, etc., can solve the problems of low bonding strength, high temperature resistant phenolic resin adhesives, low working temperature, and inapplicable materials Bonding and other problems, to achieve the effect of simple preparation method and simple curing process

Inactive Publication Date: 2010-11-03
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problem that the existing high-temperature-resistant phenolic resin adhesive has low working temperature, harsh curing process, and low bonding strength, and cannot be applied to the bonding of materials with a working temperature higher than 800°C, and provides phenolic resin / phosphoric acid Salt hybrid adhesive and preparation method thereof

Method used

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Experimental program
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specific Embodiment approach 1

[0019] Specific embodiment 1: In this embodiment, the phenolic resin / phosphate hybrid adhesive consists of 20-100 parts by weight of phenolic resin, 20-100 parts of heat-resistant reinforcing resin, 1-20 parts of coupling agent, and 5-50 parts The toughening agent is made of 11-167 parts of phosphate, 7-110 parts of curing agent, 2-22 parts of skeleton material, 0.5-10 parts of filler and 0.5-10 parts of dispersant.

[0020] The phosphate component in the phenolic resin / phosphate hybrid adhesive of this embodiment makes the adhesive have strong thermal stability and rigidity after curing, and the phenolic resin gives the system strong strength and toughness after curing, and the hybrid reaction Completed under curing conditions, a cross-linked structure of inorganic and organic interpenetrating networks is formed. This structure has the toughness of organic materials at room temperature. Under high-temperature aging conditions, the skeleton of the inorganic network still exists...

specific Embodiment approach 2

[0021] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the phenolic resin is thermosetting phenolic resin, thermoplastic phenolic resin, silicone modified phenolic resin, xylene modified phenolic resin and boron modified phenolic resin One or a combination of several of them; the thermosetting phenolic resin is prepared according to the following steps: a, the mass purity is ≥ 99.6% phenol and the mass purity is ≥ 36% formaldehyde in a molar ratio of 1: 1.0-1.6 into the reactor, start stirring, and heat up to 80-100°C; b. Add alkaline catalyst according to 0.2-3% of the amount of phenolic substances, keep the temperature of the reaction solution at 80-100°C, when the reaction liquid is turbid The reaction ends when the point temperature reaches 60-80°C; c. Wash the reaction solution twice with water at 60-90°C; d. Adjust the vacuum degree to 53328-58660Pa, heat for vacuum dehydration, and when the gel time of the resin reaches 90 ...

specific Embodiment approach 3

[0023] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that: the heat-resistant reinforcing resin is epoxy resin, polyimide resin, allyl novolac resin, propargyl novolac resin, One or a combination of bismaleimide resin or cyanate resin. Others are the same as in the first or second embodiment.

[0024] When the heat-resistant reinforced resin in this embodiment is a composition, each heat-resistant reinforced resin is mixed in an arbitrary ratio.

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Abstract

The invention provides a phenolic resin / phosphate hybrid adhesive and a preparation method thereof, relating to an adhesive and a preparation method thereof. The invention solves the problems of low working temperature, rigorous curing process and low adhesion strength of the conventional high-temperature resisting phenolic resin adhesive. The adhesive is prepared from phenolic resin, heat-resistant reinforced resin, a coupling agent, a toughening agent, phosphate, a curing agent, a framework material, fillers and a dispersing agent. The preparation method comprises the following steps of: mixing the phenolic resin, the heat-resistant reinforced resin, the coupling agent and the toughening agent and then evenly stirring to obtain a phenolic resin component; then mixing the phosphate, the curing agent, the framework material and the fillers and then evenly stirring to obtain a phosphate component; and then adding the phosphate component and the dispersing agent into the phenolic resin component and evenly stirring. The adhesive can be applied in aerospace, military and machining industries with the working temperature above 800 DEG C.

Description

technical field [0001] The present invention relates to an adhesive and a method for its preparation. Background technique [0002] The rapid development of automobile, aerospace and mechanical processing industries has put forward higher requirements for the heat resistance of adhesives, such as missile launch pad cushion parts, missile and rocket high temperature system materials, rocket and supersonic aircraft head, impact jet engine combustion Chambers, high-temperature radome materials, and atomic reactors all require high-temperature-resistant adhesives to work at a temperature higher than 500°C, and still have high bonding strength at 800°C, and maintain this performance within a specified time. The working temperature of the existing high-temperature-resistant phenolic resin adhesive modified by the hybridization of inorganic fillers is lower than 500°C, and the long-term use above 500°C will greatly reduce the bonding strength of the adhesive; the use of ceramic-mod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/10C09J161/14C09J163/00C09J179/08C09J179/04C09J11/04
Inventor 刘晓辉张大勇王超李欣赵颖王刚朱金华
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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