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Radiation sensitive linear resin composition and layer insulation film and manufacture method thereof

A technology of resin composition and interlayer insulating film, applied in the field of radiation-sensitive resin composition, can solve problems such as high flatness obstacle, and achieve the effects of high heat resistance, excellent film thickness uniformity, and high light transmittance

Active Publication Date: 2010-07-28
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in a series of processes, the coating film may have spots caused by holes for vacuum adsorption, spots caused by support pins, striped spots in the sweeping direction of the coating nozzle, etc. Obstacles of high flatness as described above

Method used

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  • Radiation sensitive linear resin composition and layer insulation film and manufacture method thereof
  • Radiation sensitive linear resin composition and layer insulation film and manufacture method thereof
  • Radiation sensitive linear resin composition and layer insulation film and manufacture method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0089] Examples of the solvent used for the preparation of the copolymer (A) include diethylene glycol dialkyl ether, propylene glycol alkyl ether acetate, propylene glycol alkyl ether propionate, ketone, alkoxypropionate, and the like.

[0090] As its specific example, as diethylene glycol dialkyl ether, for example, diglyme, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, etc.;

[0091] As propylene glycol alkyl ether acetate, for example, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, etc.;

[0092] As an alkoxy propionate, methyl 3-methoxy propionate etc. are mentioned, for example.

[0093] Among them, diethylene glycol dialkyl ether, propylene glycol alkyl ether acetate, and alkoxy propionate are preferred, and diglyme, diethylene glycol ethyl methyl ether, and propylene glycol ethyl ether acetate are particularly preferred. , Propylene Glycol Methyl Ether Acetate, Methyl 3-Metho...

Synthetic example 1

[0232] In the flask equipped with cooling tube and stirrer, add 7 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile), 200 parts by weight of diethylene glycol ethyl methyl ether. Continue to add 16 parts by weight of methacrylic acid, 16 parts by weight of methacrylic acid tricyclic [5.2.1.0 2，6 ]decane-8-yl ester, 20 parts by weight of 2-methylcyclohexyl acrylate, 40 parts by weight of glycidyl methacrylate, 10 parts by weight of styrene and 3 parts by weight of α-methylstyrene dimer, After replacing with nitrogen, stirring was started slowly. The temperature of the solution was raised to 70°C, and the temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer (A-1).

[0233] The polystyrene equivalent weight average molecular weight (Mw) of the copolymer (A-1) was 8000, and the molecular weight distribution (Mw / Mn) was 2.3. In addition, the solid content concentration (referring to the ratio of the weight of the polymer contained in...

Synthetic example 2

[0235] In a flask equipped with a cooling tube and a stirrer, 8 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) and 220 parts by weight of diethylene glycol ethyl methyl ether were added. Continue to add 11 parts by weight of methacrylic acid, 12 parts by weight of tetrahydrofurfuryl methacrylate, 40 parts by weight of glycidyl methacrylate, 15 parts by weight of N-cyclohexylmaleimide, 10 parts by weight of methacrylic acid After lauryl ester, 10 parts by weight of α-methyl-p-hydroxystyrene and 3 parts by weight of α-methylstyrene dimer were replaced with nitrogen, stirring was started slowly. The temperature of the solution was raised to 70° C., and the temperature was maintained for 5 hours to obtain a polymer solution containing a copolymer (A-2).

[0236] The polystyrene equivalent weight average molecular weight (Mw) of the copolymer (A-2) was 8000, and the molecular weight distribution (Mw / Mn) was 2.3. In addition, the solid content concentration of the polyme...

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Abstract

The invention relates to a radiation sensitive linear resin composition, a layer insulation film and a manufacture method thereof. The radiation sensitive linear resin composition also displays the excellent film thickness uniformity and has high ray sensibility even thought a slot mold coating method as the coating method. In a developing step, the development tolerance of a good pattern shape is still formed even though exceeding the best developing time. The layer insulation film has various excellent performances such as high heat endurance, high solvent resistance, high transmittance andlow dielectric constant. The radiation sensitive linear resin composition comprises (A)alkali soluble resin, (B) 1,2-quinone-bi-azide compound and (C) special polymer with siloxane chain. The layer insulation film is formed by the radiation sensitive linear resin composition.

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition, an interlayer insulating film, and a method for producing the same. Background technique [0002] Electronic components such as thin-film transistor (hereinafter referred to as "TFT") liquid crystal display elements, magnetic head elements, integrated circuit elements, and solid-state image sensor elements generally have an interlayer insulating film for insulation between layered wiring. Since the material for forming the interlayer insulating film is preferably a material that requires few steps to obtain a necessary pattern shape and has a high degree of flatness, a radiation-sensitive resin composition is widely used (see Patent Document 1 and Patent Document 2 ). [0003] Among the above-mentioned electronic components, such as TFT liquid crystal display elements, due to the process of forming a transparent electrode film on the above-mentioned interlayer insulating film an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075
CPCC08F2/48G03F7/023G03F7/027G03F7/075Y10S430/1055
Inventor 花村政晓长屋胜也丸山拓之
Owner JSR CORPORATIOON
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