Method for preparing nano-silica-containing polyimide hybrid material

Abstract

The invention provides a method for preparing nano-silica-containing polyimide hybrid material. The preparation method comprises the following steps: ultrasonically mixing nano-silica, coupling agents and toluene in a reaction kettle filled with nitrogen; stirring the mixture at a certain temperature to cool the mixture to room temperature; adding paraformaldehyde and the phenol to the sol so as to obtain transparent modified silica sol; adding diamine monomer PAPB and ODA to N,N-dimethylacetamide under nitrogen protection and stirring to completely dissolve the obtained product; adding an equimolar amount of pyromellitic dianhydride equally divided to the solution in two steps so as to obtain polyamide acid solution; adding the obtained modified silica sol to the obtained polyamide acid solution so as to obtain mixed glue solution; and placing the obtained glue solution at a certain temperature for vacuum drying so as to obtain the nano-silica-containing polyimide hybrid material. Compared with non-hybrid polyimide, the composite material synthesized by the method has better mechanical properties, thermal stability and lower coefficient of thermal expansion.

Description

technical field [0001] The invention relates to a preparation method of a polyimide hybrid material containing nano silicon dioxide in the field of chemical industry Background technique [0002] Aromatic polyimide (PI) has excellent dielectric properties, mechanical properties, thermal stability, oxidation stability, chemical resistance and radiation resistance, and has a wide range of applications. [0003] In recent years, electronic products have developed towards high performance and miniaturization, which requires electronic components and substrates on which they are mounted to also develop towards high performance and high density. [0004] General-purpose polyimide first prepares its prepolymer-polyamic acid, then forms a film, and is imidized at high temperature to form polyimide. The film has certain flexibility, strong mechanical properties and thermal stability, and has very broad application prospects in the electronics industry. [0005] However, during the ...

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Problems solved by technology

Therefore, not only will it affect the dimensional stability, but it will also easily cause the substrate to curl, warp or twist, which will affect the quality and use of the substrate.