Brazing diamond fret saw with grinding materials being arranged in order in spiral shape and manufacturing process thereof

Abstract

The invention relates to brazing diamond fret saw with grinding materials being arranged in order in a spiral shape and a manufacturing process thereof, belonging to the field of manufacturing of grinding materials and grinding apparatus. The brazing diamond fret saw is composed of a steel wire substrate, brazing bonding agent and diamond grinding materials which are arranged in a spiral shape. The key steps of the process are as follows: coating pressure sensitive adhesive on the surface of the steel wire substrate; evenly winding a fine metal silk thread or nonmetal silk thread on the steel wire coated with pressure sensitive adhesive in a certain thread pitch; arranging the diamond grinding materials; dismantling the metal silk thread or the nonmetal silk thread; arranging a layer of powdery brazing filler metal; heating to the melting of the brazing filler metal in vacuum or protective atmosphere; and fixing the cooled diamond grinding materials firmly on the surface of the steel wire through brazing bonding agent to form the brazing diamond fret saw with the grinding materials being arranged in order in a spiral shape. The fret saw has the advantages of long cutting service life and high cutting efficiency.

Description

Technical field [0001] The invention relates to a brazed diamond wire saw in which abrasives are arranged in a spiral shape orderly and a manufacturing process thereof, and belongs to the field of abrasives manufacturing. Background technique [0002] At present, the patent number is "200910137822.3" and the patent named "A method for preparing a metal bond diamond wire saw" discloses a diamond wire saw and its manufacturing process that are closest to the present invention. It is used to fix a layer of diamond abrasive on the surface of the steel wire by electrodepositing nickel. The wire saw can be used to precisely shape and cut hard and brittle materials such as silicon wafers, stone, ceramics, and optical glass. It can also be applied to aluminum alloys and other non-ferrous metals and their alloys. Cutting processing. Its advantages: (1) Narrow cutting seam, high yield rate; (2) Smooth cutting process, cutting silicon crystal, ceramics and other brittle materials without c...

AI Technical Summary

Problems solved by technology

The main problem of the diamond wire saw: the abrasive is only mechanically embedded in the coating binder, the abrasive is easy to fall off, and the life of the wire saw is short; the abrasive is arranged in disorder, and the wire saw is easy to block and slip and fail

[0004] At present, the research on brazed diamond tools is more concentrated on the production process of hollow drills, grinding wheels, saw blades, and beads, but the research on the production process of brazed diamond wire saws has not yet involved

Images