Monolithic integrated manufacturing method for indium phosphide-based resonant tunneling diodes and high-electron-mobility transistors
A technology with high electron mobility and manufacturing method, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems affecting production and application, and achieve high yield, good practicability, and strong operability. Effect
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[0033] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0034] Such as figure 1 shown.
[0035] A method for monolithically integrating an indium phosphide-based resonant tunneling diode and a high electron mobility transistor, comprising the following steps:
[0036] Step 1: On the semiconductor material indium phosphide (InP) substrate 1, use molecular beam epitaxy (MBE) equipment to grow high electron mobility transistor (HEMT) material layer 2, aluminum arsenic (AlAs) isolation self-stop layer 3 and resonance in sequence Tunneling diode (RTD) material layer 4 structure; wherein aluminum arsenic (AlAs) isolates the self-stop layer 3 to realize the corrosion self-stopping of succinic acid (SA) etching solution, and simultaneously realizes the resonant tunneling diode material 4 and high electron mobility transistor Isolation of material 2;
[0037] Step 2: On the resonant tunneling diode (RTD) material ...
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