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Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof

A technology for encapsulating carrier boards and printed circuits, which is applied in the fields of circuits, semiconductor/solid-state device manufacturing, and electrical components. It can solve problems such as low efficiency, product yield, and thick thickness, and achieve thin thickness, noise control, and product quality. The effect of increasing the rate requirements

Active Publication Date: 2010-02-24
XIAMEN INNOV INFORMATION TECH
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  • Abstract
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is: in view of the problem that the products produced by the prior art are relatively thick, the present invention can provide a rigid-flex multilayer IC packaging substrate with a thinner thickness than the prior art, so as to achieve production Thinner chip carrier to meet consumers' requirements for light and thinner mobile phones and other related electronic products
[0005] The present invention can also solve the low efficiency and product yield rate brought by the production process due to the need to rely on controlling the uniformity of product thickness to ensure the drilling accuracy of blind holes

Method used

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  • Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof
  • Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof
  • Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof

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Embodiment Construction

[0015] The invention relates to a rigid-flexible printed circuit (IC) packaging carrier and its manufacturing method. In order to improve the product quality and product performance of the multilayer printed circuit packaging carrier, the invention adopts a high Tg non-flowing PP sheet and Pure copper foil material, using Wire bonding surface treatment technology and automatic alignment and parallel exposure technology, makes the minimum line width / line spacing of the substrate reach 30 microns / 30 microns, the pitch reaches 60 microns, and the thickness of the 4-layer rigid-flex carrier board ≤240 microns, and the thickness tolerance is controlled at ±5 microns. The present invention has adopted ultraviolet and CO 2 The combination of laser and copper foil etching technology effectively avoids the need to rely on controlling the uniformity of product thickness to ensure the drilling accuracy of blind holes, making the 1-3 layer and The yield rate of 1-4 layers of blind buried...

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Abstract

The invention relates to a flex-rigid integrated circuit (IC) package substrate and a manufacturing method thereof. Aiming at improving the product quality and the product performance of the multi-layer integrated circuit package substrate, the invention adopts a high-Tg nonflowing PP sheet and pure copper foil materials and the newest wire bonding surface treatment technology and the automatic alignment and parallel exposure technology so that the minimum wire width / wire pitch of the substrate reaches 30 microns / 30 microns, the pitch reaches 60 microns, the total thickness of four layers of flex-rigid substrates is less than or equal to 240 microns and the thickness tolerance is controlled within + / -5 microns. By adopting a method for combining ultraviolet with CO2 laser and a copper foiletching alignment technology, the invention can effectively avoid the problem of ensuring the drilling accuracy of blind holes by controlling the uniformity of the product thickness and improve the yield of blind buried drilling holes at 1 to 3 layers and 1 to 4 layers of four-order flex-rigid substrate products with the thickness of 240 microns by more than 30 percent.

Description

technical field [0001] The invention relates to the field of printed circuit board packaging substrates, in particular to a rigid-flexible printed circuit (IC) packaging substrate and a manufacturing method thereof. Background technique [0002] In recent years, rigid-flex multilayer circuit boards have been used in foldable mobile phones. Rigid-flexible multilayer circuit boards in the prior art are made by forming circuits on substrates with excellent bending properties such as polyimide resin films or polyester resin films through pre-impregnated resin (PP sheets) live adhesive sheets, etc. The flexible substrate is thermocompression-bonded between rigid substrates formed by forming circuits on hard substrates such as glass epoxy resin and glass polyimide resin, and then, through drilling, plating, resist coating, and etching Wait for the process to manufacture. [0003] Among the prior art, polyimide is used as the intermediate insulator, and epoxy resin is used as the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/13H01L23/14H01L23/48H01L21/48
CPCH01L2924/0002H01L2924/00
Inventor 李金华
Owner XIAMEN INNOV INFORMATION TECH
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