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Low temperature resistant daiamid hot melt adhesive with high air tightness and application thereof

A polyamide hot-melt adhesive and hermetic sealing technology, which is applied in the direction of adhesives, etc., can solve the problems of unguaranteed flexibility and gas-holding performance, unsatisfactory low-temperature resistance and gas-holding performance, and poor product stability. Good low temperature resistance, stable product performance, and good air tightness

Active Publication Date: 2010-01-27
SHANGHAI LIGHT IND RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

US5548027, US4374231, US6306954 and domestic Zhang Huaming (China Adhesives, 1994, Vol.4, No.4, P10-13) and others have all used blending modification methods, with dimer acid polyamide as the main substrate, through The acidic modification of polyethylene, ethylene-propylene copolymer and its acidic modified elastomer and other auxiliary materials are modified, and the obtained polyamide hot melt adhesive has improved low temperature resistance and bonding, but it needs to be masticated. Various processes such as modification may easily cause poor stability of the product
US4853460, EP354521, US4207217, US4914162, US4882414 and other patents introduce different polyamide hot melt adhesives, but these products all improve the performance of a certain aspect of hot melt adhesives, such as improving the adhesion to metal, or improving the The tensile strength of the product, etc., but the low temperature resistance and gas retention performance are not ideal, so it is mostly used in filled heat shrinkable sleeves
In Chinese patent CN 1215746, polyamide or polyester amide hot-melt adhesives with network structural units are developed by introducing multifunctional acids or alcohols to copolymerize with dimer acid and ethylenediamine. The hot peel strength of the hot melt adhesive is improved, but the good high-temperature adhesive performance is at the expense of the initial bond strength, so strict requirements are put forward for the construction conditions; at the same time, the flexibility and gas retention of the product are due to the moderate interaction Combined and crystallized so that its application at -40°C is not guaranteed
Therefore, the scope of application is limited

Method used

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  • Low temperature resistant daiamid hot melt adhesive with high air tightness and application thereof
  • Low temperature resistant daiamid hot melt adhesive with high air tightness and application thereof
  • Low temperature resistant daiamid hot melt adhesive with high air tightness and application thereof

Examples

Experimental program
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Effect test

Embodiment

[0054] The following examples are used to further illustrate the present invention, but it should be understood that these examples cannot be used to limit the protection scope of the present invention.

[0055] In the following examples, the performance parameters of the polyamide hot-melt adhesive of the present invention were determined as follows.

[0056] Softening point test:

[0057] On the SYP4202-I asphalt softening point tester, the test is carried out according to the standard GB / T 15332-94.

[0058] Melt viscosity test:

[0059] The melt viscosity of the sample was tested by a Brookfield DV-E rotary viscometer, and 8.0g of polyamide hot melt adhesive sample was weighed. During the test, the rotor model S27 was selected, the temperature was controlled at 200 °C, and the rotational speed was constantly adjusted to make it The test value is within the linear range of 10% to 90%, and the measured value is recorded after stabilization.

[0060] Determination of acid ...

Embodiment P1

[0090] Add 286.9 grams of dimerized linoleic acid (British Croda Company, Pripol 1013, 95% dimeric acid content) and 6.1 grams of decane in a 1000ml reaction flask with a thermometer, a mechanical stirrer, a condenser tube and a nitrogen inlet tube. Acid; 35.7 grams of ethylenediamine was placed in a 100ml constant pressure dropper; nitrogen gas was introduced, stirred, and heated to raise the temperature. When the temperature in the reaction bottle reached 120-130°C, the mixed amines were added dropwise, and the temperature was controlled at 130-140°C. ℃. After the dropwise addition, add 5 drops of phosphoric acid and 12.1g of stearic acid into the reaction bottle, and start to slowly heat up to about 230-240°C; 204g of liquid nitrile rubber CTBN1300×18 (U.S. Emerald company, Hycar series reaction) was weighed in advance. Type liquid nitrile rubber) and preheat the rubber to 80°C-90°C, and add it into the reaction bottle in a transparent liquid state with good fluidity; at th...

Embodiment P2～P4

[0093] Same as Example P1, except that carboxyl-terminated liquid nitrile rubber (Hycar series liquid rubber, Emerald Company of the United States) of different models and different proportions is used.

[0094] The product obtained from Example P4 has the characteristics of low-temperature resistance of -25°C and excellent air-tight performance that can reach 12 high and low temperature cycles without air leakage.

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Abstract

The invention relates to low temperature resistant daiamid hot melt adhesive with high air tightness and application thereof. The daiamid hot melt adhesive comprises a dimer unsaturated fatty acid polymerization unit, a C2-C12 aliphatic diamine polymerization unit, and 1 to 30 molar percent of chemigum polymerization unit by taking total molar number of the dimer unsaturated fatty acid polymerization unit or the aliphatic diamine polymerization unit as reference. Compared with the conventional daiamid hot melt adhesive, the air tightness of the daiamid hot melt adhesive is obviously improved.

Description

technical field [0001] This application relates to polyamide hot-melt adhesive and its application, especially low-temperature-resistant polyamide hot-melt adhesive with high airtightness and its application. Background technique [0002] As a hot-melt adhesive material, polyamide has the characteristics of non-toxicity, good oil and chemical resistance, and good adhesion to polar materials. It is widely used in textile, shoemaking, automobile and other industries. [0003] In recent years, with the development of electric power, telecommunications, railway, rail transit, construction and other industries, the corresponding cable industry has also developed rapidly. During the laying process of communication cables and power cables, various joints need to be coated for protection; various transmission pipelines also need to be protected by coating for anti-corrosion and heat preservation. The covering materials of these cables and pipes are generally heat-shrinkable materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/06C09J9/00
Inventor 孙静祝爱兰施才财
Owner SHANGHAI LIGHT IND RES INST
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