Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Binding manufacture technology for electrical element of flat-panel display

A technology of flat panel display and electrical components, applied in the field of binding production technology of flat panel display electrical components

Inactive Publication Date: 2010-01-13
GUANGDONG SINODISPLAY TECH
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these practices and measures can only reduce corrosion, but cannot completely avoid the occurrence of corrosion, and abnormal display problems of flat-panel displays still occur from time to time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Binding manufacture technology for electrical element of flat-panel display
  • Binding manufacture technology for electrical element of flat-panel display

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] Now set forth the present invention in detail in conjunction with accompanying drawing:

[0011] The present embodiment is to bind IC on the flat panel display substrate, and its process steps are: 1) make lead wire on the flat panel display substrate, carry out glass cutting process to lead wire; 2) clean lead wire; 3) coat protective film material on lead wire and pre-curing; 4) exposure treatment of the protective film; 5) development and main curing of the protective film to form the pattern required for the protective film; 6) paving the opposite sex conductive film and IC; 7) thermocompression bonding of the electrical components .

[0012] figure 1 with figure 2 Among them, 1 is the substrate, 2 is the lead wire, 3 is the anisotropic conductive film, 4 is the IC, 5 is the conductive ball, and 6 is the protective film.

[0013] The protective film material is thermoplastic resin or thermoplastic polymer containing polyamide. The characteristics of these two ma...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a binding manufacture technology for an electrical element of a flat-panel display, which is characterized of comprising the following steps of: 1) manufacturing a lead wire of the flat-panel display; 2) cleaning the lead wire; 3) paving a protection film on the lead wire; and 4) subsequently binding the electrical element. A coating work procedure of the protection film of the lead wire is as follows: coating material of the protection film-previously solidifying-exposing-developing-mainly solidifying. The material of the protection film is thermoplastic resin or polyamide-containing thermoplastic polymer. After improving the technology, after manufacturing the lead wire at the base plate of the flat-panel display, a layer of protection film is paved on the lead wire immediately, to prevent the lead wire from being corroded to affect electricity-conduction capability caused by contacting with the other medium in the subsequent process of machining.

Description

Technical field: [0001] The invention relates to a production process for binding electrical components of a flat panel display. Background technique: [0002] It is well known that chemical and electrochemical corrosion occurs when metals come into contact with surrounding media due to the tendency of metals to transform into ions. The electrode lead wires and the logic lead wires on the circuit substrate of the existing flat panel display IC bonding process are all exposed. In the production process, glass cutting, handling, cleaning and IC bonding are required for the substrate. When IC is bonded, the bonding process must go through the attachment of anisotropic conductive mold and the hot pressing of IC to make the conductive mold The conductive ball connects the IC with the electrode leads and logic leads on the substrate, etc. After the IC is hot-pressed and bonded, the protective glue is applied, and the connection between the lead and the conductive ball is covered ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/48H01L21/50H01L21/603H01L21/56H05K3/28
Inventor 谢志生
Owner GUANGDONG SINODISPLAY TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products