Metal coating plumbago composite material and method of producing the same

Abstract

The invention provides a metal plating (copper or nickel or zinc) graphite compound material and a preparation method thereof. One of the preparation method is degreasing and coarsening the surface of the graphite radiating material; soaking and washing the processed material in sensitizing solution and activating solution; and finally carrying out chemical plating of copper or nickel or zinc and the like in plating solution, drying and post-treatment to obtain the finish product. The other preparation method is carrying out degreasing, coarsening and other pre-processing on the surface of the graphite radiating material before electroplating, and then carrying out electroplating in electroplating solution to obtain the finish product. By both of the preparation methods provided by the invention, whether chemical plating or electroplating, a graphite board material which can beautify the graphite cooling plate, improve the strength of the graphite cooling plate and add the connecting mode (like welding) of the graphite cooling plate and the metal base material can be obtained. The metal plating graphite compound material has the characteristics of low density, high heat conductivity and strength, and easy joining with metals, is an outstanding radiating material, and can be widely used in thermal management systems of electronic products.

Description

field of invention [0001] The invention relates to a graphite composite material, in particular to a graphite composite sheet or plate with a metal-coated surface and a preparation method thereof. Background technique [0002] During the use of electronic components, due to the heat generated inside the components, which cannot be dissipated, it is easy to cause relatively extreme temperatures in the system and cause damage to the devices themselves. Therefore, electronic components generally only work effectively within a certain threshold temperature range. These Overheating of electronic components not only impairs their own performance, but also reduces the performance and reliability of the entire system. The progress in the miniaturization of electronic products has increased the complexity of circuit design, thereby increasing the number of electronic components per unit space. Therefore, more effective heat dissipation devices and materials are needed to dissipate th...

AI Technical Summary

Problems solved by technology

[0004] At present, in Chinese patent CN1666079A, etc., graphite heat dissipation materials are bonded on metal substrates such as aluminum and copper to form heat dissipation equipment in electronic equipment. However, the application of traditional graphite materials in heat dissipation equipment has the following defects: first appearance It is not very elegant; the second is that the thermal conductivity becomes poor after being connected to the metal substrate. Due to the smooth surface of the graphite product, it is difficult to achieve a close connection with the metal substrate only by inserting the graphite sheet heat dissipation material into the metal substrate. If the graphite heat sink is connected to the metal substrate, the thermal conductivity of the product will be affected; thirdly, the strength of the product itself is relatively small. If a fan and other loads are added to the cooling equipment containing the graphite heat sink, graphite may appear during long-term work. Accidents such as looseness and falling off of the heat sink affect the performance of the entire cooling device