Resin binding agent for a diamond wire saw and preparation method thereof

Abstract

The invention relates to a resin binding agent for a diamond wire saw and a preparation method thereof. The resin binding agent comprises the following components by the weight proportion: 30 to 90 portions of UV cured resin, 1 to 30 portions of solvents, 1 to 30 portions of inorganic fillers, 0.5 to 20 portions of mixed crystal whiskers, 0.5 to 10 portions of accelerating agents and 0.5 to 10 portions of coupling agents. The adopted resin is positive ion cured UV resin; a photoinitiator is selected from chloride diphenyl iodine salt or sulfur chloride triphenyl salt; and a prepolymer is selected from an activated epoxy compound or a polyalcohol mixture. The solvent is an activated monomer solvent; one or more of acrylic acid monomers or vinyl ethers with the simple function or the multifunction are adopted; the mixed crystal whisker is a silicon-contained crystal whisker and a polytetrafluoroethylene crystal whisker mixture; the accelerating agent is selected from a compound containing 1 to aziridine or ethylene phosphate, a vulcanization type chain transfer agent, and one or more of thiobarbituric acid ester different kwai or dodecyl mercaptan; and the coupling agent is a silane coupling agent. The invention has the advantages of low energy consumption, no pollution and high cutting efficiency.

Description

technical field [0001] The invention belongs to the semiconductor material processing industry and provides a resin binder for diamond wire saws and a preparation method thereof. Background technique [0002] In the 1970s, the process of cutting brittle semiconductor materials with a diamond wire saw was proposed, and in the 1980s, a diamond wire saw that could be used for cutting silicon wafers appeared. In the 1990s, especially in recent years, diamond wire saws have developed rapidly, and their research has become more in-depth. Due to the high cost of fixed abrasive cutting wire saws, the wire saws used in wire cutting mainly use suspended abrasives for cutting, no matter at home or abroad. However, fixed abrasive cutting has gradually replaced suspended abrasive cutting due to its advantages of low energy consumption, no pollution to the use environment, high cutting efficiency, and high machining accuracy. [0003] The focus of China's research is on the manufacture ...

AI Technical Summary

Problems solved by technology

Since the production speed is still low and the cost is high, it is not yet possible to replace suspended abrasive cutting on a large scale

[0005] Some scholars in Japan proposed a new method of using UV curable resin instead of traditional thermosetting resin as a bond to consolidate diamond abrasives. They mainly focused on the study of acrylic UV curable resin, but due to the resin strength and resin and wire holding force are not good enough. Cutting requirements, so the method is still in the stage of further research

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