Low temperature production method of transparent conductive oxide film
A technology of transparent conductive film and oxide film, applied in the direction of ion implantation plating, coating, metal material coating process, etc., can solve the problem of increasing the growth process of TCO film, which is not conducive to the growth of optoelectronic properties of TCO film materials, flexible linings, etc. The bottom is not resistant to high temperature and other problems, and the effect of selectivity, flexible preparation process and small dependence is achieved.
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Embodiment 1
[0025] The single crystal oxide substrate material (SrTiO 3 ) was cleaned with acetone, then with ethanol, and finally ultrasonically cleaned with deionized water. After cleaning, it was blown dry with a nitrogen gun, and immediately placed in a vacuum chamber. -5 Torr; with sintered ceramic TiO 2 sheet as a target, with a purity better than 99.99% O 2 As the deposition atmosphere, the seed layer film was prepared by pulsed laser deposition method, and the control: the substrate temperature was 400-450K, and the absolute pressure of the background was lower than 5×10 -4 Torr, the laser energy density is 5J / cm 2 , with a frequency of 5 Hz, deposited O2 The divided voltage is 1×10 -3 Torr, the vertical distance between the target and the substrate is 40 mm; after the deposition process is completed, cool to room temperature with the furnace, cut off the oxygen, and take it out. The thickness of the seed layer film is controlled at 0.5 to several unit cell c-axis lengths;
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Embodiment 2
[0028] The single crystal oxide substrate material (LaAlO 3 ) was cleaned with acetone, then with ethanol, and finally ultrasonically cleaned with deionized water. After cleaning, it was blown dry with a nitrogen gun, and immediately placed in a vacuum chamber. -5 Torr; with sintered ceramic TiO 2 sheet as a target, with a purity better than 99.99% O 2 As the deposition atmosphere, the seed layer film was prepared by pulsed laser deposition method, and the control: the substrate temperature was 450-500K, and the absolute pressure of the background was lower than 5×10 -4 Torr, the laser energy density is 6J / cm 2 , with a frequency of 8 Hz, deposited O 2 The divided voltage is 1×10 -2 Torr, the vertical distance between the target and the substrate is 50 mm; after the deposition process is completed, cool to room temperature with the furnace, cut off the oxygen, and take it out. The thickness of the seed layer film is controlled at 0.5 to several unit cell c-axis lengths;
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Embodiment 3
[0031] The single crystal oxide substrate material (SrLaAlO 4 ) was cleaned with acetone, then with ethanol, and finally ultrasonically cleaned with deionized water. After cleaning, it was blown dry with a nitrogen gun, and immediately placed in a vacuum chamber. -5 Torr; with sintered ceramic TiO 2 sheet as a target, with a purity better than 99.99% O 2 As the deposition atmosphere, the seed layer thin film was prepared by pulse laser deposition method, and the control: the substrate temperature was 420-480K, and the absolute pressure of the background was lower than 5×10 -4 Torr, the laser energy density is 7J / cm 2 , with a frequency of 3 Hz, deposited O 2 The divided voltage is 1×10 -4 Torr, the vertical distance between the target and the substrate is 45 mm; after the deposition process is completed, cool to room temperature with the furnace, cut off the oxygen, and take it out. The thickness of the seed layer film is controlled at 0.5 to several unit cell c-axis lengt...
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