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Lamination sheet type wave filter and method for producing the same

A filter and layer-chip technology, applied in the field of high-performance low-cut-off frequency laminated chip filter and its preparation, can solve the problems of narrow operating frequency range of filter, poor out-of-band suppression performance, large filter volume, etc. , to achieve the effect of large out-of-band suppression, large quality factor, and widening of the working frequency band

Inactive Publication Date: 2009-04-08
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Compared with the single-element form, the LC structure increases the number of elements to improve the filter's rectangularity and out-of-band suppression. In order to take into account the inductance and capacitance of the LC structure in a small-sized low-cut-off frequency multilayer chip filter , two ways are usually used: one is to use composite materials, which have the properties of dielectric ceramics and ferrite materials, that is, have a large dielectric constant and a large magnetic permeability, and can realize large inductance at the same time and large capacitors, but at the same time increase the value of parasitic parameters, resulting in the narrow operating frequency range of the filter, poor out-of-band suppression performance and other shortcomings, the operating frequency can only be controlled within 1500MHz; another way is to develop inductors and capacitors separately, and then The inductor and capacitor chips are connected together by soldering. The filter obtained by this method has a large volume, a long production cycle, and a high cost.

Method used

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  • Lamination sheet type wave filter and method for producing the same
  • Lamination sheet type wave filter and method for producing the same
  • Lamination sheet type wave filter and method for producing the same

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Embodiment Construction

[0029] A multilayer chip filter, such as figure 2 As shown, it is a laminated chip composite device composed of a laminated chip capacitor, a laminated chip air core inductor and a laminated chip core inductor. It has a laminated chip structure, and the middle laminated part is made of ferrite The laminated chip core inductor made of bulk material, the upper and lower laminated parts of the core inductor are laminated chip capacitors made of ceramic materials, the difference between the laminated chip core inductor and the laminated chip capacitor The laminated part between them is a laminated chip air-core inductor made of ceramic materials.

[0030] In terms of electrical connection, the magnetic core inductor is connected in series with the upper and lower air core inductors, one of which is connected to the input electrode of the entire filter, and the other air core inductor is connected to the output electrode of the entire filter; the magnetic core inductor There are t...

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Abstract

The invention belongs to the technical field of electronic components and relates to a multi-layer chip filter and a preparation method thereof. The filter leads in ceramics and ferrite in the same chip and simultaneously realizes large inductance and large capacitance; wherein, the inductance consists of a hollow inductance (a 'magnetic core' is a ceramic material) and a magnetic core induction (the magnetic chip is ferrite material). The hollow inductance is characterized by small inductance value, large quality factor, high self-resonance frequency, and the like, thus being capable of better broadening the working frequency section of the filter; the magnetic core inductance has the characteristics of large inductance value, low self-resonance frequency, and the like, thus better reducing the in-band insertion loss of a filter with a low cut-off frequency and improving the effect of the transmission signal of the filter. The preparation method of the multi-layer chip filter includes the steps such as material preparing, casting, punching, pore filling, conductor printing, chip overlapping, isostatic pressing, gumming, sintering, etc. The filter has the advantages of small size, large rectangle degree, large out-band rejection as well as broad working frequency. The preparation method has high controllability and can be compatible with the technique of the existing chip components.

Description

technical field [0001] The invention belongs to the technical field of electronic components, and in particular relates to a high-performance low-cutoff frequency laminated chip filter and a preparation method thereof. Background technique [0002] At present, when developing and producing small-sized low-cutoff frequency multilayer chip filters, two methods are mainly used: [0003] (1) Single component form. [0004] Pure inductance or pure capacitance type, this type of filter has the disadvantage of poor squareness; [0005] (2) LC structure form. [0006] Compared with the single-element form, the LC structure increases the number of elements to improve the filter's rectangularity and out-of-band suppression. In order to take into account the inductance and capacitance of the LC structure in a small-sized low-cut-off frequency multilayer chip filter , two ways are usually used: one is to use composite materials, which have the properties of dielectric ceramics and fe...

Claims

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Application Information

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IPC IPC(8): H03H7/09H03H3/00
Inventor 尉旭波杨邦朝王浩勤徐自强曾志毅游钦禄练马林唐伟钱可伟
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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