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Alloy for liquid-phase diffusion bonding

一种液相扩散、合金的技术,应用在焊接介质、焊接设备、金属加工设备等方向

Inactive Publication Date: 2012-04-18
NIPPON STEEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of P does not always give excellent results for steel materials

Method used

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  • Alloy for liquid-phase diffusion bonding
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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0047] The effects of the present invention are explained below based on Examples and Comparative Examples of the present invention. In Example 1 of the first invention, master alloys of each composition shown in Table 1 below were cast using electrolytic Fe, electrolytic Ni, B, and C each having a purity of 99.9% by mass in an argon atmosphere. Each master alloy was remelted in a quartz crucible with a slot opening of 25 mm wide and a gap of 0.4 mm and sprayed through the slot onto the running surface of a copper cooling roll with a peripheral speed of 25 m / sec to quench to form a 25 μm thick non-ferrous metal. Shaped foil. The melting point is then determined from the endothermic or exothermic temperature upon melting / solidification by heating and cooling the foil. The results are also shown in Table 1.

[0048] Table 1

[0049]

[0050] Using the bonding alloy foils of Examples and Comparative Examples prepared above, bonding tests were performed and bonding strength ...

Embodiment 2

[0057] Example 2 of the first embodiment of the present invention is explained below. In this Example 2, the master alloys of each composition shown in Table 3 below were cast using electrolytic Fe, electrolytic Ni, B, Si, and C each having a purity of 99.9% by mass in an argon atmosphere. Each mother alloy foil was prepared in the same manner as in Example 1 above. In the same manner as in Example 1, a bonding test was performed and the bonding strength was measured. Fe-based alloy material STK 400 was used as the base material to be joined. The results are shown in Table 3 below.

[0058] table 3

[0059]

[0060] As shown in Table 3, the bonding alloys of sample numbers 31 to 37, the concentration of Si was kept within the range of the present invention, indicating that the ratio (strength of the bonding portion) / (strength of the base material) was 1.00 or more, that is, Sample Nos. 31-37 were excellent in bonding strength. In contrast, in the bonding alloy of Compa...

Embodiment 3

[0062] Example 3 of the first embodiment of the present invention is explained below. In this Example 3, master alloys of each composition shown in Table 4 below were cast using electrolytic Fe, electrolytic Ni, B, Si, C, W, Mo, and Cr each having a purity of 99.9 mass % under an argon atmosphere. Each mother alloy foil was prepared in the same manner as in Example 1 above. In the same manner as in Example 1, a bonding test was performed and the bonding strength was measured. Fe-based alloy material STK 400 was used as the base material to be joined. The results are shown in Table 4 below.

[0063] Table 4

[0064]

[0065] As shown in Table 4 above, Comparative Sample Nos. 41 to 43 in which the concentrations of each of the main components Fe and Ni were outside the range of the present invention hardly lowered the melting point even if Mo was added within the concentration range of the present invention, and ( The ratio of the strength of the joint part) / (strength of ...

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Abstract

An alloy having a low melting point for liquid-phase diffusion bonding capable of bonding both Ni-based heat resistance alloy material and Fe-based steel material. The alloy comprises in atom percent (%): 22 < Ni = 60, B: 12-18, C: 0.01-4, and the balance being Fe and residual impurities; or comprises in atom percent (%): 22 < Ni = 60, B: 7-18, 4 < C = 11, and the balance being Fe and residual impurities.

Description

[0001] This application claims Japanese application 2006-027705, filed in Japan on January 31, 2006, Japanese application 2006-284080, filed in Japan on October 18, 2006, and Japanese application 2006-348064, filed in Japan on December 25, 2006 priority and are hereby incorporated by reference in their entirety. technical field [0002] The present invention relates to alloys for liquid-phase diffusion bonding for joining metal materials by liquid-phase diffusion, particularly alloys suitable for use in various parts or structures constructed by liquid-phase diffusion bonding of carbon steel, stainless steel, heat-resistant steel, and the like. Background of the Invention [0003] The liquid-phase diffusion bonding method joins the base materials (that is, the materials to be joined) by inserting a metal (hereinafter simply referred to as "intercalation metal") therebetween in the form of foil, powder or plate having a melting point lower than that of the base material, and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30
CPCC22C19/03C22C19/051B23K35/30Y10T428/12931
Inventor 坂本广明佐藤有一长谷川泰士水原洋治
Owner NIPPON STEEL CORP
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