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Preparation of m-xylene diamine epoxide resin

The technology of m-xylylenediamine epoxy resin and m-xylylenediamine is applied in the field of preparation of diminutive amine epoxy resin, and can solve the problems of no known preparation method, complicated production process and the like, and achieves high epoxy value, Low viscosity effect

Inactive Publication Date: 2009-01-21
ZHONGHAO CHENGUANG RES INST OF CHEMICALINDUSTRY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The production process of m-xylylenediamine epoxy resin is more complex than that of bisphenol A type epoxy resin, and there is no report on its preparation method

Method used

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  • Preparation of m-xylene diamine epoxide resin

Examples

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Comparison scheme
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Embodiment 1

[0025] Add 300g of m-xylylenediamine and 0.3g of benzyltriethylammonium chloride into the reactor, mix well, add 60g of epichlorohydrin dropwise at 35°C for 1 hour, and continue etherification at 35°C for 6 hour, reclaim the remaining m-xylylenediamine (water can be added appropriately in the recovery process), reclaim the terminal temperature 100 DEG C, pressure-0.08Mpa, reclaim complete, drip concentration at 50 DEG C and be the sodium hydroxide solution 175g of 15%, 1 Add 1 hour, react at 70°C for 5 hours, add 600g toluene to dissolve the product at 50°C for 0.5 hour, separate the m-xylylenediamine epoxy resin solution, wash the resin solution with hot water at 50°C until it is neutral, and remove the solvent , the final temperature is 120°C, and the pressure is -0.08Mpa.

[0026] Product index: epoxy value 1Eq / 100g, viscosity 20000mpa.s.

Embodiment 2

[0028] Add 300g of m-xylylenediamine and 900g of benzene into the reactor, mix well, add 840g of epichlorohydrin, etherify at 80°C for 1.5 hours, then add 950g of 40% sodium hydroxide dropwise, and close the ring at 50°C React for 3 hours, add 600g of benzene and dissolve at 40°C for 0.5 hours, wash the resin solution with hot water at 40°C until it is neutral, and remove the solvent. The final temperature is 100°C and the pressure is -0.09Mpa.

[0029] Product index: epoxy value 0.94Eq / 100g, viscosity 16500mpa.s.

Embodiment 3

[0031] Add 300g of m-xylylenediamine and 900g of methyl isobutyl ketone into the reactor, mix well, add 840g of epichlorohydrin, etherify at 50°C for 3 hours, then add dropwise 40% sodium hydroxide 950g , ring-closing reaction at 50°C for 3 hours, add 600g of methyl isobutyl ketone and dissolve at 70°C for 0.5 hour, wash the resin solution with hot water at 70°C until neutral, remove solvent, final temperature 100°C, pressure -0.09Mpa .

[0032] Product index: epoxy value 0.95Eq / 100g, viscosity 20000mpa.s.

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Abstract

The invention provides a method for preparing a meta-xylylene diamine epoxy resin, which comprises the following steps of: reacting meta-xylylene diamine with chloroepoxy propane, an additive and alkali at a temperature of between 30 to 85 DEG C; recovering (or not) the rest chloroepoxy propane or meta-xylylene diamine; obtaining the meta-xylylene diamine epoxy resin after processing. The meta-xylylene diamine resin prepared through the method can be cured at a room temperature and be used at a high temperature with low viscosity and a high epoxide number.

Description

technical field [0001] The present invention relates to a kind of preparation method of shrinkage amine epoxy resin, particularly relate to a kind of preparation method of m-xylylenediamine epoxy resin. Background technique [0002] Epoxy resin generally refers to organic polymer compounds containing two or more epoxy groups in the molecule. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain. Since the molecular structure contains The active epoxy groups enable them to undergo cross-linking reactions with various types of curing agents to form insoluble, infusible high polymers with a three-way network structure. [0003] Ordinary bisphenol A type epoxy resin molecules contain two epoxy groups, and the heat-resistant temperature of the room temperature cured product is mostly in the range of 60-80 ° C. The m-xylylenediamine epoxy resin molecule contains four epoxy groups. group, the cured product has high cross-linking dens...

Claims

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Application Information

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IPC IPC(8): C08G59/10
Inventor 谭周琴张杰
Owner ZHONGHAO CHENGUANG RES INST OF CHEMICALINDUSTRY CO LTD
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