Optoelectronic combination printing circuit board with optical interconnection direct coupling between chips

Abstract

An optoelectronic hybrid printed circuit board provided with an inter-chip optical interconnection direct-coupling structure belongs to the photoelectron and optical communication field and aims at realizing non-lens direct optical coupling, simple-structure coupling and an optical receiving-emitting module to be pluggable for the inter-chip optical interconnection. For the invention, a laser device on the surface of a vertical cavity and a PIN optical receiver are respectively coupled in an optical manner with an optical waveguide layer of an embedded printed circuit through an optical coupling adapter formed by a lower locating plate, an optical fiber array and an upper cover plate. The optical fiber array is embedded into a parallel rectangle trough of the lower locating plate and is covered by the upper cover plate and is solidified by a UV glue; one end of the upper cover plate, one end of the lower locating plate and the optical fiber array are polished into optical planes and the other ends of the lower locating plate and the optical fiber array are all polished into 45-degree end faces. The invention just needs less optical elements and the non-lens direct optical coupling, the simple-structure coupling and the pluggable optical receiving-emitting module are all realized; the invention can be applied to the broadband, high-speed and high-capacity information communication networks and the high-capability computer process-transmission systems.

Description

technical field [0001] The invention belongs to the fields of optoelectronics and optical communication. Background technique [0002] With the continuous improvement of people's requirements for high-speed data transmission, the computer processing speed is required to develop in the direction of ultra-high-performance computer systems with petaflops and petaflops per second. Broadband, high-speed, and large-capacity information processing and transmission put forward higher requirements for interconnection speed, bandwidth, and density between printed circuit boards, between boards and backplanes, and between chips in the system. The "electrical interconnection" method of metal lines between chips on the traditional printed circuit board PCB has encountered a bottleneck. Due to its inherent serious crosstalk, RC delay, clock skew, bottleneck blocking and sharp increase in power consumption, etc., it has been unable to meet the requirements of high-speed information proces...

AI Technical Summary

Problems solved by technology

This structure uses two sets of microlens arrays to couple the optical waveguide layer and the optical transceiver device. The microlens arrays are fabricated on the chip and the printed circuit board respectively, which requires high device manufacturing and alignment accuracy and difficult coupling.

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