Steel member acidic electroplating additive for copper pre-plating and pre-plating process
An additive and process technology, applied in the field of copper plating of steel parts, can solve the problem of inability to directly plate copper, and achieve the effects of increased discharge potential, fine crystallization and good bonding
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[0043] 1. The formula of additives
[0044] 1. The formula of the main light agent: as the embodiment of the present invention, the weight of the raw materials (unit: gram) contained in the main light agent of the additive per liter of solution except water can be as follows:
[0045] (1) Recipe 1
[0046] Fatty alcohol polyoxyethylene ether 1.0, benzotriazole 0.2, ethanol 10.0, formaldehyde 10.0, benzylidene ketone 0.2, Kena green B0.1, copper sulfate 2.0.
[0047] (2) Recipe 2
[0048] Alkylphenol polyoxyethylene ether 1.5, 2-mercaptobenzimidazole 0.1, methanol 10.0, vanillin 0.2, acetone 2.0, methyl violet 0.05, zinc sulfate 3.0.
[0049] (3) Recipe 3
[0050] Polyethylene glycol 1.5, allylthiourea 2.0, glycerin 3.5, jasmonal 0.1, methine green 0.05, methyl orange 0.05, titanium sulfate 1.0.
[0051] (4) Recipe 4
[0052] Polypropylene glycol 2.0, ethylene thiourea 1.5, methionine 2.5, ethanol 8.0, o-chlorobenzaldehyde 0.2, phenolphthalein 0.1, copper sulfate 5.0, zinc...
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