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Silver base cadmiumless middle temperature solder and preparation thereof

A silver-based, medium-temperature technology, used in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of high cost, narrow application range, poor technical indicators such as solder melting temperature and melting range, etc. The effect of good plasticity and cost reduction

Inactive Publication Date: 2008-09-17
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problems that the existing cadmium-free silver-based solder has high cost, poor technical indicators such as the melting temperature and melting range of the solder, and is very brittle and difficult to be processed into welding wire, resulting in a narrow use range, and provides a silver-based solder. Cadmium-based medium-temperature solder and preparation method thereof

Method used

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  • Silver base cadmiumless middle temperature solder and preparation thereof
  • Silver base cadmiumless middle temperature solder and preparation thereof
  • Silver base cadmiumless middle temperature solder and preparation thereof

Examples

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specific Embodiment approach 1

[0008] Specific Embodiment 1: The silver-based cadmium-free medium-temperature solder of this embodiment consists of 19-20 parts of Ag, 13.04-37.61 parts of electrolytic copper, 32-33 parts of Zn, 2.5-8.0 parts of Sn, 2.14 to 8.56 parts of copper-phosphorus alloy with a phosphorus content of 14%, 1.5 to 2.0 parts of Mn, 0.2 to 0.7 parts of Zr, and 5.05 to 10.8 parts of rare earth lanthanum wrapped in copper foil; the rare earth wrapped in copper foil The lanthanum is made of 5.0-10.0 parts of copper foil and 0.05-0.8 parts of rare earth lanthanum in parts by weight.

[0009] The rare earth lanthanum coated with copper foil is prepared as follows: put 0.05-0.8 parts of rare earth lanthanum into the center of 5.0-10.0 parts of copper foil, and wrap the rare earth lanthanum tightly with copper foil.

specific Embodiment approach 2

[0010] Specific embodiment two: the silver-based cadmium-free medium-temperature brazing filler metal of the present embodiment is by weight the phosphorus content of the Ag of 19.5 parts, the electrolytic copper Cu of 25.5 parts, the Zn of 32.5 parts, the Sn of 6.0 parts, 6.0 parts is 14% copper-phosphorus alloy, 1.7 parts of Mn, 0.5 parts of Zr and 8.4 parts of rare earth lanthanum wrapped in copper foil; wherein the rare earth lanthanum wrapped in copper foil consists of 8.0 parts of copper foil and 0.4 parts of Made of rare earth lanthanum.

specific Embodiment approach 3

[0011] Specific embodiment three: The silver-based cadmium-free medium-temperature solder described in specific embodiment one is prepared as follows: 1. By weight, 0.2 to 0.7 parts of zirconium, 1.5 to 2.0 parts of manganese and 13.04 to 37.61 parts of electrolytic Put the copper into the crucible of the intermediate frequency furnace, heat up to 650-850°C, add a covering agent on the surface of the alloy, continue to heat up to 1100-1250°C, and add 2.14-8.56 parts of phosphorus containing 14% (weight ) of copper-phosphorus alloy and 32-33 parts of zinc, after melting, stir at a speed of 15-20r / min, then add 19-20 parts of silver and 2.5-8.0 parts of tin, and then add a covering agent for 3-5 minutes After cooling down to 980-1050°C, add 5.05-10.8 parts of rare earth lanthanum wrapped in copper foil, and stir at a speed of 15-20r / min to remove slag when the furnace smoke turns milky white. Cool down to 950-1000°C and release 2. Casting: remove the air bubbles contained in the...

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Abstract

The invention relates to a silver base cadmium-free medium temperature solder and a preparation method thereof, which overcomes the defects of high cost of cadmium-free silver base solder, poor technical indicators of melting temperature and range, high brittleness, and narrow application range due to difficulty in machining into soldering wire. The silver base cadmium-free medium temperature solder comprises silver, copper cathodes, zinc, tin, copper-phosphorus alloy, manganese, zirconium, copper foil and lanthanum; or nickel, silver, copper cathodes, zinc, tin, copper-phosphorus alloy, manganese, zirconium, copper foil and lanthanum. The preparation method of the silver base cadmium-free medium temperature solder comprises the following steps: feeding, warming up, cooling and discharging, casting, and extruding to obtain the silver base cadmium-free medium temperature solder. The solder has the advantages of no cadmium, low content of silver, and good welding performance.

Description

technical field [0001] The invention relates to a medium-temperature solder and a preparation method thereof. Background technique [0002] Over the past 30 years, with the vigorous development of industries such as electronic information industry, home appliances, automobiles, military industry and building decoration materials, the demand for brazing materials has increased, and brazing technology has played an important role in these emerging industries . According to incomplete statistics, only home appliance manufacturing needs to consume 300 tons of silver solder per year in China, and building materials processing tools needs to consume 350 tons of silver solder per year in China. Due to the high price of silver, silver-based solder containing cadmium is mostly used. Silver-based solder containing cadmium can not only reduce the liquidus of the alloy, narrow the melting temperature range, and improve the brazing process, but also can braze copper and copper alloys. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/40
Inventor 李卓然冯吉才刘彬顾伟
Owner HARBIN INST OF TECH
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