Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micro-mechanism testing probe card based on electroplating technique and manufacturing method thereof

An electroplating process and micro-mechanical technology, applied in electronic circuit testing, processes for producing decorative surface effects, metal material coating processes, etc. Effect

Active Publication Date: 2008-07-09
深圳市道格特科技有限公司
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of the design requirements of this silicon cantilever beam probe, in order to generate sufficient displacement of the needle tip, it is necessary to ensure a considerable length
This limits the probe array can only be densely arranged in one direction, which greatly limits its application range

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro-mechanism testing probe card based on electroplating technique and manufacturing method thereof
  • Micro-mechanism testing probe card based on electroplating technique and manufacturing method thereof
  • Micro-mechanism testing probe card based on electroplating technique and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] a Deposit or oxidize a layer of 0.5-2.5 μm oxide layer on the (100) silicon wafer, and then sputter or evaporate a layer of 0.1-0.5 μm titanium-copper metal seed layer on the oxide layer (as shown in Figure 4- as shown in a);

[0044] b Use a layer of 25-35 μm thick photoresist to perform photolithography to form a pattern mask for the first electroplating (as shown in Figure 4-b);

[0045] c Carry out the first nickel electroplating, make the upper planar cantilever structure, remove the photoresist and metal seed layer; then, use the spray glue to photoetch the oxide layer pattern for subsequent corrosion (as shown in Figure 4-c );

[0046] dUsing the oxide layer as a mask, use 50 °C, 40% potassium hydroxide solution (KOH) to perform anisotropic etching of silicon; and deposit a second time on the upper surface of the entire silicon wafer and the etched deep groove slope and bottom surface 0.1-0.5 μm titanium-copper metal seed layer (as shown in Figure 4-d);

[004...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Sintering temperatureaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a micro mechanical testing probe card based on electroplating process and a manufacturing method thereof, and is characterized in that, cantilevers and probe tips are manufactured and formed on a silicon wafer with electroplated metal nickel; the probe tips are manufactured on an (111) inclined surface of the silicon wafer, and each probe tip is connected with a ceramic substrate with one or two probe cantilevers; the probe cantilevers and the probe tips adopt an isostress beam structure; probes on an flip chip substrate are intensively arranged in two directions. The manufacturing is characterized in that: firstly, the upper surface of the (100) silicon wafer is taken as the electroplated working face, and the probe cantilevers of a low stress nickel layer is formed by electroplating; and then a deep groove (111) inclined surface produced by anisotropic etching is taken as the working face, and the probe tips of the low stress nickel layer is formed by electroplating, and then the probes are connected with a package substrate by a flip chip process, and finally the probe structure is released through a method of removing the corrosion of the silicon wafer.

Description

technical field [0001] The invention relates to a wafer-level chip test probe based on a micro-mechanical method and a manufacturing method thereof, in particular to a micro-mechanical chip test probe based on an electroplating process and a manufacturing method thereof, belonging to the field of micro-electromechanical systems. Background technique [0002] In recent years, with the continuous progress of microelectronics technology, the integrated circuit manufacturing industry has developed rapidly. The production process of integrated circuit chips mainly includes front-end processing technology and back-end packaging and testing technology. Among them, the back-end packaging and testing process has already accounted for most of the cost of the entire production process. Therefore, adding wafer-level chip testing between the front-end processing technology and the back-end packaging and testing technology has become a necessary means to reduce chip costs. Probe cards a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B81B3/00B81C1/00G01R1/073G01R31/28
Inventor 李昕欣汪飞封松林
Owner 深圳市道格特科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com