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Epoxy resin encapsulating material composition

A technology of epoxy resin and encapsulation materials, applied in other chemical processes, chemical instruments and methods, circuits, etc., can solve the problems of unsuitable automatic encapsulation of electronic components, high initial viscosity and high linear expansion coefficient, and achieve excellent fluidity, The initial viscosity is low and the effect of meeting environmental protection requirements

Active Publication Date: 2008-05-07
靖江德方科技服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the above composition can reduce the initial viscosity and linear expansion coefficient of the epoxy resin encapsulation material to a certain extent, improve operability and prevent the surface cracking of the cured product, but the initial viscosity and linear expansion coefficient are still high, still not suitable for Automatic packaging of electronic components requiring high precision

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This example is used to illustrate the epoxy resin encapsulating material composition and its preparation method provided by the present invention.

[0027] 12 parts by weight of γ-(methacryloyloxy)propyltrimethoxysilane was mixed with 100 parts by weight of spherical fused silicon powder with an average particle diameter of 15 microns and a silicon content of 99.9% by weight for 80 minutes, wherein the particle diameter was not Silicon powder with a particle size of more than 1 micron accounts for 10% by volume of the total amount of silicon powder. After standing for 30 hours, it is vacuum-dried to obtain silicon powder containing a coupling agent. The measured average particle size of the silicon powder containing a coupling agent is less than 3 microns. Containing 10% by volume of the total amount of silicon powder as a coupling agent, the weight ratio of γ-(methacryloxy)propyltrimethoxysilane to silicon powder is 1:10. Then with 16 parts by weight of cyanoguanidine...

Embodiment 2

[0031] This example is used to illustrate the epoxy resin encapsulating material composition and its preparation method provided by the present invention.

[0032] Prepare the epoxy resin encapsulation material composition according to the method for Example 1, the difference is that the silicon content of the spherical fused silicon powder added in the composition is 46% by weight, to obtain the epoxy resin encapsulation material composition provided by the present invention S2.

Embodiment 3

[0034] This example is used to illustrate the epoxy resin encapsulating material composition and its preparation method provided by the present invention.

[0035] The epoxy resin encapsulation material composition was prepared according to the method of Example 1, except that no dibutyl phthalate was contained in the composition, and the epoxy resin encapsulation material composition S3 provided by the present invention was obtained.

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PUM

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Abstract

An epoxy resin encapsulation material composition, the composition contains epoxy resin, a curing agent and inorganic filler particles containing a coupling agent, wherein the particle diameter of the inorganic filler particles containing a coupling agent is 0.1-200 microns , wherein the inorganic filler particles containing a coupling agent whose particle diameter is not more than 3 microns account for 5-20% by volume of the total amount of the inorganic filler particles containing a coupling agent. The epoxy resin encapsulating material composition provided by the present invention can greatly increase the filling ratio of the inorganic filler, thus making the epoxy resin encapsulating material composition provided by the present invention have low initial viscosity, excellent fluidity, and linear expansion coefficient Low, the production cost of obtaining epoxy resin encapsulation materials with the same initial viscosity is greatly reduced. In addition, the composition provided by the invention has excellent dielectric properties and is suitable for the packaging of various electronic components sensitive to stress, especially for automatic packaging of electronic components requiring high precision.

Description

technical field [0001] The invention relates to an epoxy resin encapsulation material composition. Background technique [0002] Packaging is to reasonably arrange, connect and isolate the components that make up the electrical device according to the requirements, so as to prevent the intrusion of moisture, dust and harmful gases to the electronic components, prevent external force damage and stabilize component parameters. Epoxy resin encapsulation material is the most widely used one, and it has good bonding effect on metal and non-metal. At present, there are many types of epoxy resin packaging materials used in China, but they generally have the disadvantage of high expansion coefficient. When the system including epoxy resin packaging materials is subjected to alternating cold and heat, thermal stress will be generated between the packaging materials and electrical components. After the epoxy resin encapsulation material is cured, the cured product will have cracks or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/10C08L63/00C08K5/5415C08K3/36H01L23/29
Inventor 张玉梅
Owner 靖江德方科技服务有限公司
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