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Combination cooling method and device of microchannel single convective flow and capillary microgroove phase conversion heat

A technology of phase conversion heat and cooling method, which is applied in the direction of instrument cooling, cooling/ventilation/heating modification, and instrument, etc. It can solve the problems of large total heat dissipation capacity, high heat flow density, small heat dissipation area, etc., and achieve good cooling Effect of heat dissipation, high strength, and high convective heat transfer coefficient

Inactive Publication Date: 2011-12-21
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the technical defects that the existing air-cooled and water-cooled heat dissipation technologies require a large heat dissipation area and insufficient heat dissipation capacity, and provide a microchannel single-convection and heat dissipation system with small heat dissipation area, high heat flow density and large total heat dissipation capacity. Capillary micro-groove phase-change thermal combined cooling method and device

Method used

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  • Combination cooling method and device of microchannel single convective flow and capillary microgroove phase conversion heat
  • Combination cooling method and device of microchannel single convective flow and capillary microgroove phase conversion heat
  • Combination cooling method and device of microchannel single convective flow and capillary microgroove phase conversion heat

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Embodiment 1

[0025] Example 1: see figure 1 , many circular microchannels 2 are arranged inside the metal plate or other heat-conducting materials 1 to form a microchannel group, and many rectangular capillary microgrooves 3 are arranged on the outer surface to form a capillary microgroove group, which has microchannels and capillary microgrooves The heat exchange structure is called a heat sink. See figure 1 , image 3 , the microchannels 2 are densely arranged laterally inside the thermally conductive material 1, see figure 1 , figure 2 , the capillary micro-grooves 3 are vertically densely arranged. The diameter of the microchannel 2 is in the range of 0.05-1mm, the distance between the microchannels is in the range of 0.05-5mm, the length of each microchannel is in the range of 5-50mm, and the cross-section of the microchannel is circular, and the capillary microgroove 3 The channel is a rectangular micro channel, its width and channel depth are in the range of 0.05-2mm, and the ...

Embodiment 2

[0027] Example 2: see figure 2 In this embodiment, the plurality of capillary microgrooves 3 of the heat sink are densely arranged vertically, and the capillary microgrooves 3 arranged longitudinally are densely arranged with a plurality of transverse capillary microchannels 3 ′. The capillary microchannels 3' arranged horizontally can ensure the capillary driving force of the liquid working medium flowing along the longitudinal capillary microchannels 3 under ultra-high heat load, so that the liquid working medium evaporated in the heated area can be replenished in time, thereby improving the cooling efficiency. In this embodiment, the groove width of the capillary micro-channel 3 is 0.2mm, the groove depth is 0.5mm, and the groove spacing is 0.2mm, and the groove width of the transverse capillary micro-channel 3' is 0.4mm, the groove depth is 0.8mm, and the groove spacing is 5mm.

Embodiment 3

[0028] Embodiment 3: see Figure 4 , a plurality of capillary grooves 4 of the heat sink in this embodiment are vertically densely arranged, and its cross section is trapezoidal. .

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Abstract

The invention discloses a microchannel single convective flow and capillary microgroove phase conversion thermal combination cooling method and device thereof, which relate to a heat radiation cooling method and special components. The method is: the high-boiling point liquid working medium flows through the surface of the heating element, absorbs heat and enters many micro-channels provided inside a heat-conducting material, and there are many capillary micro-grooves that can generate capillary force on the outer surface of the heat-conducting material. Force sucks another low-boiling point liquid working fluid into the capillary microgroove, and the high-boiling point liquid working medium in the microchannel transfers heat to the heat-conducting material through high-intensity micro-scale single convective heat transfer, and the heat-conducting material heats the outer surface Another low-boiling liquid working fluid in the capillary micro-groove, this liquid working medium produces high-intensity evaporation and boiling after being heated, and takes away the heat of the heating element. The heat exchange structure in which microchannels are arranged inside the heat conducting material and capillary microgrooves are arranged on its outer surface is a special device for the method of the invention.

Description

Technical field: [0001] The invention relates to a heat radiation cooling method, in particular to a cooling method and a device for high-power electronic and optoelectronic devices. Background technique: [0002] At present, there are mainly two ways to cool high-power electronic and optoelectronic devices: one is to use heat sinks combined with fans for air cooling. Thermal silica gel (silicone grease) is used to reduce the thermal resistance of heat conduction, and the fan is placed on the end face of the heat dissipation fin to use the principle of convection heat transfer to dissipate heat to the environment through the surface of the fin to ensure that the device works within the normal operating temperature range. The main defect of this technology is: as the power of electronic and optoelectronic devices increases, the greater the heat dissipation required to maintain normal operating temperature, the greater the power consumption of the fan, and the greater the heat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G12B15/06
Inventor 胡学功王涛唐大伟
Owner INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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