Non-contact smart card and its production method

Abstract

The invention relates to a non-contact smart card and a manufacturing method of the non-contact smart card. The non-contact smart card comprises a core layer composed of a chip, a polymer base layer containing an antenna, and a packed layer, wherein, the thickness of the packed layer is larger than or equal to that of the chip; the chip, which connects with the antenna, is positioned in a hole arranged in the packed layer. The invention adopts the metal-etching method to make the antenna, thereby not only improving the anti-bending property and stability of the product and leading the antenna adaptable to humid and high-temperature environments, but also lowering the cost. Due to adoption of the inverted-patch technology, the chip can be directly dismounted from a wafer and put on the etched antenna in the polymer base layer to form the tight connection between the chip and the antenna without the need of module capsulation, so the cost for chip capsulation is lowered. The use of the perforated packed layer reduces the stress onto the chip in lamination, strengthens the protection on the chip and improves the product yield rate.

Description

technical field [0001] The invention relates to a non-contact smart card and a manufacturing method thereof. Background technique [0002] Contactless smart cards are more and more widely used in people's daily life, and are often used as means of identification and micropayment. The production method of the current contactless smart card is roughly divided into three steps: [0003] The first step is to fill the encapsulated chip into the hole on the polymer substrate; [0004] The second step is to create the antenna on the polymer base layer. There are two most widely used methods of manufacturing antennas, one is to use ultrasonic waves to embed copper wires in the polymer base layer, and the other is to use screen-printed antennas; [0005] The third step is to connect the packaged chip to the metal antenna on the base layer by welding; [0006] The fourth step is to attach several layers of polymer on the upper and lower layers of the base layer, as well as the pol...

AI Technical Summary

Problems solved by technology

When screen printing is used for ordinary printing, it is convenient, simple and low in cost, but the antenna made by this method has the disadvantages of low yield and high price (using pure silver powder and curing glue)

Moreover, the cured glue of the printed antenna has poor ductility, which makes the card produced has poor bending resistance.

Moreover, due to the poor stability of the curing glue, it is limited by the use environment. Under certain extreme conditions, such as high humidity and low temperature environments, the curing glue will undergo qualitative changes, which will affect the conductivity of the antenna and the electrical performance of the card. In case of failure

[0008] At present, the methods of module welding and direct chip sticking used in card making have their own disadvantages: the cost of module packaging is too high; the method of direct chip sticking does not protect the chip enough, causing the card to be easily damaged.

[0009] In the process of hot pressing, due to the previous technology, it is difficult to press the core layer with the antenna and the card substrate layer, resulting in insufficient peel strength of the card

[0010] Therefore, there are several disadvantages in this smart card made of packaged chips. First, when the finished smart card is bent, the stress is more concentrated on the packaged chip, causing damage to the chip or detachment of solder joints to cause failure; Second, the cost of chip packaging is relatively high

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