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Soldering paste and its preparation method

A solder paste and solder powder technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of incomplete and bright solder joints, poor adaptability of lead-free solder paste, and color and luster of residue residues, and achieve full solder joints. Bright, adaptable, no-clean effect

Inactive Publication Date: 2008-03-19
彩星控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing lead-free solder paste is generally composed of solder powder and flux, which can be used to solder electronic products. These lead-free solder pastes have many disadvantages, such as: unsatisfactory adhesion and printability; solder joints are not full and bright; There are obvious residues after welding and the residues are dark in color, which must be cleaned with organic solvents
[0003] The lead-free solder paste provided by the disclosed "lead-free solder paste and its preparation method" of Chinese invention patent application publication CN1565790A includes tin-based alloy solder powder, mixed alcohol ether, natural rosin, natural vegetable oil thixotropic agent, organic acid and additive ( Additives are composed of release agent, antioxidant, polymerization inhibitor, flux and wetting agent), this lead-free solder paste can complete the soldering process relatively smoothly, with good surface activity, full and bright solder joints, and can be used after soldering Cleaning, but there is still a small amount of residue after soldering, the residue is colored (lighter in color), and this lead-free solder paste has poor adaptability and cannot be well suited for reflow soldering temperature curves under different types of reflow soldering equipment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Taking the preparation of 1000 grams of solder paste as an example, this preparation method includes the following steps in sequence:

[0024] (1) Weigh alloy solder powder Sn 96.5 Ag 3.0 Cu 0.5 827.5 grams, 60 grams of organic solvents (of which 50 grams of nitromethane, 5 grams of ethanol, and 5 grams of methanol), 68 grams of organic acids (of which 8 grams of oxalic acid, 7 grams of glutaric acid, 21 grams of malonic acid, dodeca 32 grams of diacid), 30 grams of resin (wherein 20 grams of water-white hydrogenated rosin, 10 grams of turpentine) and 14.5 grams of surfactants (wherein 13 grams of TX-10 phosphate, 1.5 grams of fully hydrogenated castor oil); and prepare a dry , clean reaction vessel;

[0025] (2) Add the above-mentioned organic solvent into the reaction vessel, heat and stir at the same time, so that the material inside the reaction vessel is evenly heated to 130°C to 132°C;

[0026] (3) Keep the temperature of the reaction vessel at 130°C to 132°C...

Embodiment 2

[0031] Taking the preparation of 1000 grams of solder paste as an example, this preparation method includes the following steps in sequence:

[0032] (1) Weigh alloy solder powder Sn 99 Ag 0.3 Cu 0.7 850 grams, 80 grams of organic solvents (including 30 grams of dipropylene glycol methyl ether, 30 grams of ethylene glycol, and 20 grams of butyl acetate), 15 grams of organic acids (including 5 grams of methylene succinic acid, p-tert-butyl benzoic acid 10 grams), resin 50 grams (wherein 40 grams of perhydrogenated rosin, polymerized rosin 5 grams, hydrogenated rosin methyl ester 5 grams) and surfactant 5 grams (wherein polyethylene glycol 2 grams, nonylphenol polyoxyethylene ether 2 grams, 1 gram of alkylphenol polyoxyethylene ether); and prepare a dry, clean reaction vessel;

[0033] (2) Add the above-mentioned organic solvent into the reaction vessel, heat and stir at the same time, so that the material inside the reaction vessel is evenly heated to 135°C to 137°C;

[00...

Embodiment 3

[0039] Taking the preparation of 1000 grams of solder paste as an example, this preparation method includes the following steps in sequence:

[0040] (1) Weigh alloy solder powder Sn 95.5 Ag 4.0 Cu 0.5885 grams, 65 grams of organic solvent (of which 65 grams of tetrahydrofurfuryl alcohol), 27 grams of organic acid (of which 4 grams of succinic anhydride, 5 grams of dodecanoic acid, 13 grams of hexadecanoic acid, 5 grams of benzoic acid), 20 grams of resin (wherein 20 grams of hydrogenated rosin) and 3 grams of surfactants (wherein 1 gram of butylene glycol, 1 gram of polyethylene glycol, and 1 gram of castor oil polyoxyethylene ether); and prepare a dry, clean reaction vessel;

[0041] (2) Add the above-mentioned organic solvent into the reaction vessel, heat and stir at the same time, so that the material inside the reaction vessel is evenly heated to 137°C to 139°C;

[0042] (3) Keep the temperature of the reaction vessel at 137°C to 139°C, while stirring, add the above-m...

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PUM

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Abstract

The invention provides a soldering paste and a method of manufacturing the soldering paste. The composition of the soldering paste and the weight percentage of the composition are 80 to 90 per cent of ally welding power, 6 to 8 per cent of organic solvent, 2 to 10 per cent of resin and 0.2 to 2 per cent of surface active agent. The soldering paste provided by the invention has properly proportioned surface active agent, thereby making a welding point bright. The organic acid of the soldering paste of the invention is suitable for various solder-reflow temperature curves, so the soldering paste of the invention has good application, which is able to well finish the process of welding on various solder-reflow devices. As the soldering paste of the invention adopts the appropriate and well proportioned resin, with the completion of welding, no remainder is left around the welding point, which does not need to be cleaned.

Description

technical field [0001] The invention relates to a solder paste for soldering when surface assembly components and electronic circuits are interconnected, and a preparation method of the solder paste. Background technique [0002] The existing lead-free solder paste is generally composed of solder powder and flux, which can be used to solder electronic products. These lead-free solder pastes have many disadvantages, such as: unsatisfactory adhesion and printability; solder joints are not full and bright; There are obvious residues after welding and the residues are dark in color and must be cleaned with organic solvents. [0003] The lead-free solder paste provided by the disclosed "lead-free solder paste and its preparation method" of Chinese invention patent application publication CN1565790A includes tin-based alloy solder powder, mixed alcohol ether, natural rosin, natural vegetable oil thixotropic agent, organic acid and additive ( The additives are composed of release ...

Claims

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Application Information

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IPC IPC(8): B23K35/22B23K35/26B23K35/363
Inventor 周振基周博轩
Owner 彩星控股有限公司
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