Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Copper bonding or superfine wire with improved bonding and corrosion properties

A technology of bonding wires and ultra-fine wires, which can be used in household appliances, transportation and packaging, and other household appliances, etc., and can solve problems such as damage to semiconductors and inappropriate hardness of bonding wires

Inactive Publication Date: 2008-03-05
HERAEUS MATERIALS TECHNOLOGY GMBH & CO KG
View PDF1 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this hardness is not suitable for bonding wire, because it may damage the semiconductor when pressing the bonding wire or ultra-fine wire on the semiconductor bonding pad.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper bonding or superfine wire with improved bonding and corrosion properties
  • Copper bonding or superfine wire with improved bonding and corrosion properties
  • Copper bonding or superfine wire with improved bonding and corrosion properties

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0039] As can be seen from Figures 1 and 2, the copper bonding wire or ultra-fine wire 1 with a 14nm gold coating according to the present invention has corrosion stability and has a comparable corrosion resistance to bonding wires made of pure gold or pure copper. Loop shear-off force (Loop-Abreisskraft). Thus, the bonding wire according to the present invention has corrosion stability compared to pure copper wire 4 and has improved conductivity and stability compared to gold bonding wires. In the manner of the invention, it is possible to choose from two possibilities, namely: making an alloy, or coating the copper wire with gold, wherein the increased hardness of the gold-copper alloy does not play a role in the bonding process, so , the chip 29 to be bonded will not be damaged when the bonding wire or ultra-fine wire is pressed on the chip.

[0040] Although the gold-copper alloy is considered hard, the balls 21 provided for the bonding process remain soft despite the cor...

example 2

[0042] Electrolytic plating is performed on copper wire with a purity of 99.995%. The output diameter of the copper wire is 250 μm.

[0043] The gold-coated wire was drawn into a wire with a thickness of 25 μm by repeated drawing. In the subsequent annealing treatment, the wire was set to a breaking load of 13 cN and an elongation at break of 14% was obtained ("soft state"). To prevent oxidation of the freshly drawn wire, the wound wire is vacuum welded in a polyethylene (PE) protective film.

[0044]If the gold did not diffuse into the copper (or if the copper did not diffuse into the gold), the wire used here had a coating with a thickness of 20nm. Diffusion blurs the phase boundaries, so the coating thickness is only for a virtual outer layer that doesn't really exist because of the diffusion. The wire thus obtained takes on the color of copper. Therefore, in describing the present invention, the reference to the gold outer layer or coating is not used, but the referenc...

example 3

[0046] The bonding wire 20 described above was stored open and after a predetermined period of time, according to ASTM, 100 Barr Harbor Drive, West Conshohocken, Pennsylvania 19428-2959 and G.G. Harman, "Wire Bonding in Microelectronics", McGraw-Hill 1997, pp. 67ff) Carry out bonding test.

[0047] Joining conditions are as follows:

[0048] The ball-wedge joint (ESEC 3088) has the following joint parameters:

[0049] a) Solder ball terminal (Impact 2000; Force 3000; Time 32; US 80) and

[0050] b) Wedge end (Impact 300; Force 1500; Time 30; US 20)

[0051] The numbers indicate the parameters of the engaging device.

[0052] Use the following substrates:

[0053] 1. Gold-plated Cu-Sn6 substrate

[0054] 2. Aluminum-sprayed silicon chip

[0055] Figure 1 shows the breaking force of the coil. The breaking force can be determined by means of a tensile tester (DAGE BT 22) by the so-called Hook test (cf. literature: MIL STD 883F, June 18, 2004, Microcircuits, Method 2011.7)....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

A bonding or superfine wire is provided made of copper, with a gold enrichment on the surface thereof, in particular in an amount corresponding to a coating of at most 50 nm. The wire may be bonded by the ball / wedge method, has a copper-colored appearance, and the ball thereof after flame-off has a hardness of less than 95 according to HV0.002. In order to produce the bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. The wires are bonded to a semiconductor silicon chip.

Description

technical field [0001] The present invention relates to a ball-wedge bonding method for bonding copper bonding wires or ultra-fine wires to semiconductor silicon chips, copper ultra-fine wires and bonding wires suitable for semiconductor electrical connection and their manufacturing methods, and their use in semiconductors. application. Background technique [0002] According to "Wire Bonding in Microelectronics" by G.G. Harman ("Wire Bonding in Microelectronics", McGraw-Hill 1997, pp.1-10, pp.67ff and pp.203ff), in the ball-wedge bonding method , using a flame ball (also known as an air-free ball (Free-Air-Ball, FAB)) to bond a bonding wire or an ultra-fine wire to a chip. [0003] Bonding wires are connecting wires that make connections to electronic semiconductor components such as integrated circuit processors or sensors. The semiconductor components have so-called contact pads (also called solder pads). Preferably, the bonding wire has a spherical widening at its one...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49
CPCH01L2224/45015H01L2224/85205H01L2924/01014H01L2924/20752H01L24/45H01L2224/456H01L2924/01047H01L2224/48624H01L2924/19042H01L2924/014H01L2224/45664H01L2224/45164H01L2224/45644H01L2924/0105H01L2224/05624H01L2924/01029H01L2224/48799H01L2224/45147H01L2224/43825H01L2224/45144H01L2224/45565H01L2924/01013H01L2924/01005H01L2924/01082H01L2924/01033H01L2924/01046H01L2224/859H01L2924/01079H01L2924/01204H01L2224/85045H01L2924/10253Y10S428/941H01L2924/01006H01L2224/45673H01L2224/48463H01L2924/01019H01L2924/14H01L2924/01068H01L2224/45139H01L24/85H01L2224/43848H01L2924/00011H01L24/48Y10T428/12438Y10T428/12431Y10T428/12458Y10T428/2938H01L2924/00014H01L2924/00H01L2224/48824H01L2924/00015H01L2924/20755H01L2924/2075H01L2924/2076H01L2924/20754H01L2924/01049H01L23/49H01L23/48
Inventor 阿尔布雷希特·比朔夫海因茨·弗德雷尔卢茨·施雷普勒弗兰克·克吕格尔
Owner HERAEUS MATERIALS TECHNOLOGY GMBH & CO KG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com