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Method for surface treating calender copper foil of printing circuit board

A technology of printed circuit boards and rolled copper foils, applied in the secondary treatment of printed circuits, improvement of metal adhesion of insulating substrates, etc. Improve corrosion resistance, fast oil removal, good roughening effect

Inactive Publication Date: 2007-11-21
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the past copper foil surface treatment process, the barrier layer coating treatment generally adopts galvanizing, nickel sulfur, nickel phosphorus and other treatment methods, but the galvanized copper foil has the disadvantage of poor corrosion resistance, and the nickel-plated copper foil has There are restrictions on the use of specific etching solutions, and other treatment methods also have certain problems in specific use
[0006] In addition, the rolled copper foil also has problems such as serious surface oil pollution, easy to be corroded, and difficult to handle; the low surface roughness cannot meet the requirements of pressed copper clad laminates
[0007] In view of the characteristics of heavy oil pollution and easy corrosion on the surface of rolled copper foil, a degreasing process suitable for rolled copper foil is required; in addition, due to the characteristics of very smooth surface and low surface roughness of rolled copper foil, roughening is required. treatment, but it should also be considered that excessive roughening treatment will affect the uniformity of rolled copper foil

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The technological process and steps of the present embodiment are as follows:

[0022] (1) Weak alkaline degreasing treatment: put the 35μm rolled copper foil in Na 2 CO 3 10g / L, Na 3 PO 4 12H 2 O15g / L, Na 2 SiO 3 9H 2 O 5g / L weak alkaline mixed degreasing liquid, treated at a temperature of 50°C for 5 seconds; then rinsed with deionized water for 3 times, and washed with 12% dilute sulfuric acid for 2 times, and then deionized Rinse with water 3 times;

[0023] (2) Primary roughening treatment: the above-mentioned rolled copper foil after pickling is placed in a Cu-containing 2+ 15g / L, H 2 SO 4 30g / L, Cl - 4ppm, AS 5+ In a 0.4g / L electroplating solution, at a temperature of 20°C and a current density of 25A / dm 2 Copper electroplating was performed for 5 seconds under certain conditions; then rinsed 3 times with deionized water;

[0024] (3) Secondary roughening treatment: The rolled copper foil after the above treatment is roughened again, and placed...

Embodiment 2

[0029] The process and steps of this embodiment are exactly the same as those of Embodiment 1 above, except that some process parameters are changed.

[0030] (1) Weak alkaline degreasing treatment: put the 35μm rolled copper foil in Na 2 CO 315g / L, Na 3 PO 4 12H 2 O20g / L, Na 2 SiO 3 9H 2 O 8g / L weak alkaline mixed degreasing liquid, treated at 60°C for 5 seconds; then rinsed with deionized water for 3 times, and washed with 12% dilute sulfuric acid for 2 times, and then deionized Rinse with water 3 times;

[0031] (2) Primary roughening treatment: the above-mentioned rolled copper foil after pickling is placed in a Cu-containing 2+ 20g / L, H 2 SO 4 60g / L, Cl - 7ppm, AS 5+ In a 0.4g / L electroplating solution, at a temperature of 30°C and a current density of 35A / dm 2 Electroplate copper for 3 seconds under certain conditions; then rinse with deionized water 3 times;

[0032] (3) Secondary roughening treatment: The rolled copper foil after the above treatment i...

Embodiment 3

[0037] The process and steps of this embodiment are exactly the same as those of Embodiment 1 above, except that some process parameters are changed.

[0038] (1) Weak alkaline degreasing treatment: put the 35μm rolled copper foil in Na 2 CO 3 30g / L, Na 3 PO 4 12H 2 O30g / L, Na 2 SiO 3 9H 2 O 10g / L weak alkaline mixed degreasing liquid, treated at 60°C for 5 seconds; then rinsed with deionized water for 3 times, and washed with 12% dilute sulfuric acid for 2 times, and then deionized Rinse with water 3 times;

[0039] (2) Primary roughening treatment: the above-mentioned rolled copper foil after pickling is placed in a Cu-containing 2+ 35g / L, H 2 SO 4 90g / L, Cl - 10ppm, AS 5+ In a 0.4g / L electroplating solution, at a temperature of 30°C and a current density of 55A / dm 2 Copper electroplating was performed for 5 seconds under certain conditions; then rinsed 3 times with deionized water;

[0040] (3) Secondary roughening treatment: The rolled copper foil after ...

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PUM

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Abstract

A method for treating calendaring copper foil surface of printing circuit board is carried out by pre-treating by weak alkali mixed oil remover with Na2CO3, Na3PO4 and Na2SiO3, primary coarse treating, electroplating copper by electroplating liquid containing copper ion, H2SO4 and arsenic ion, clad treating by barrier, zinc-nickel alloy clad treating, passivating and electroplating chromium clad treating to obtain final product. It has better combination with printing base plate and corrosion resistance.

Description

technical field [0001] The invention relates to a method for surface treatment of rolled copper foil for printed circuit boards; the rolled copper foil is a key conductive material for manufacturing high-frequency printed circuit boards and fine circuit printed circuit boards, and belongs to the manufacturing process technology of printed circuit boards field. Background technique [0002] Copper foil can be divided into rolled copper foil and electrolytic copper foil. Electrodeposited copper foil has a columnar crystal structure, which is produced by electrodeposition. Its rough side is a rough side, and the opposite side is a smooth side. The rough side is generally treated with corresponding surface treatment during use. Rolled copper foil has a layered structure and is manufactured by mechanical rolling. Its surface is very smooth and its surface roughness is very low. In most cases, electrolytic copper foil is used, and rolled copper foil is only used in special occas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/10H05K3/38
Inventor 谈定生余德超王松泰
Owner SHANGHAI UNIV
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