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Polyimide metal laminate and suspension for hard disk using same

A polyimide and polyimide-based technology, which is applied in the field of hard disk suspensions and polyimide metal laminates, can solve the problem of lack of thermal stability research of polyimide resin and polyimide metal laminate. The effect of the heat resistance of the body has been fully exhibited, and the effect of small change in characteristics and good heat resistance is achieved.

Inactive Publication Date: 2007-10-31
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although some effects on humidity warpage and dimensional stability have been obtained by controlling the linear humidity expansion coefficient to a low level, no research has been conducted on the thermal stability of high thermal expansion polyimide resins in contact with metals. Therefore, it cannot be said that the effect of the heat resistance of the polyimide metal laminate has been fully expressed.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0052] Hereinafter, the present invention will be described in more detail based on Examples and Comparative Examples. Among them, the evaluation of various characteristics of the examples was performed according to the following methods.

[0053] [Evaluation of Thermal Expansion and Deformation]

[0054] A polyimide-based resin layer is formed on the metal foil to form a polyimide metal laminate. Then, it was introduced into an inert oven (manufactured by Espec) with an ambient temperature of 350°C, and left for 60 minutes. Then, the polyimide metal laminate was taken out from the inert oven, and after cooling to room temperature, the metal foil on one side was removed by etching, and the surface of the polyimide resin was checked for swelling using a 100-fold stereo microscope. And peeling (whether deformed). In the case of peeling, the size of the peeling was measured, and when there was peeling of 100 μm or more, it was judged as unacceptable, and when there was no peeling of ...

Synthetic example 1

[0076] Synthesis of Thermoplastic Polyimide Precursor

[0077] The tetracarboxylic dianhydride and diamine described in Table 1 were weighed and dissolved in 630 g of DMAc in a 1000 ml separable flask under nitrogen flow. After the dissolution, stirring was continued for 6 hours, polymerization reaction proceeded, and thermoplastic polyimide precursor varnishes A to D were obtained.

[0078] A

Synthetic example 2

[0080] Synthesis of Thermoplastic Polyimide Precursor

[0081] The tetracarboxylic dianhydride and diamine described in Table 2 were weighed and dissolved in 630 g of DMAc in a 1000 ml separable flask under nitrogen flow. After the dissolution, stirring was continued for 6 hours, polymerization reaction was performed, and thermoplastic polyimide precursor varnishes E to I were obtained.

[0082] E

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PUM

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Abstract

Disclosed is a polyimide metal laminate wherein a copper foil and a stainless steel foil are formed on respective sides of a polyimide resin, or a stainless steel foil is formed on both sides of the polyimide resin. This polyimide metal laminate is characterized in that the peel strength between the stainless steel foil or copper foil and the polyimide resin is not less than 1.0 kN / m, the peel strength between the stainless steel foil or copper foil and the polyimide resin after thermally treating the polyimide metal laminate at 350 DEG C for 60 minutes is not less than 1.0 kN / m, and no swelling or deformation occurs in the polyimide metal laminate after the 60-minute heat treatment at 350 DEG C.

Description

Technical field [0001] The present invention relates to a polyimide metal laminate that is widely used in a flexible wiring board, a wireless suspension of a hard disk drive, and the like, and a hard disk suspension using the same. [0002] In further detail, it relates to polyimide suitable for high-density circuit board materials that can be assembled at high temperatures and can be ultra-fine processing because polyimide has good heat resistance and little change in characteristics after heat treatment. Amine metal laminate and a suspension for hard disks using the same. Background technique [0003] At present, with the increase in density and speed of hard disk drives, so-called wireless suspensions in which copper wiring is directly formed on the suspensions are mainly used for hard disk drive suspensions. As a material for the wireless suspension, a polyimide metal laminate formed of copper alloy / polyimide / SUS304 is widely used. [0004] As a method of manufacturing a wire...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/088B32B15/08G11B21/21C08G73/10
CPCG11B5/4833H05K1/0346B32B15/08H05K1/056B32B27/20Y10T428/31681C08G73/1042C08G73/1067H05K2201/0355H05K2201/0154B32B15/18B32B15/20
Inventor 广田幸治中泽巨树
Owner MITSUI CHEM INC
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