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Temperature-evenness loop heat pipe device

A loop heat pipe and thermostat technology, applied in circuits, tubular components, heat transfer modification, etc., can solve problems such as unsatisfactory effects, achieve obvious heat transfer capacity and effect, improve flexibility and accuracy, and be flexible. The effect of improved performance and precision

Inactive Publication Date: 2007-10-24
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when the existing loop heat pipe device is used to dissipate heat from high heat flux electronic chips, its effect is not ideal.

Method used

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  • Temperature-evenness loop heat pipe device
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  • Temperature-evenness loop heat pipe device

Examples

Experimental program
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Effect test

Embodiment 1

[0022] As shown in Figure 1, a heat pipe device for a uniform temperature circuit includes an evaporator 1, a compensator 2 and a thermostat 3, and the evaporator 1 and the compensator 2 are placed in the same container 7; the condensation end 11 of the evaporator 1 is connected to the The compensator 2 is connected, the evaporating end 12 of the evaporator 1 is connected with the condensing end 35 of the thermostat 3, the evaporator 1 is equipped with a liquid-absorbing core 4, and a steam groove is formed between the channel at the bottom of the liquid-absorbing core 4 and the evaporator 1 Road 41, the steam channel 41 communicates with the steam pipeline 5, the outer surface of the steam pipeline 5 is provided with a condenser 6, and the return pipe of the steam pipeline 5 communicates with the compensator 2; the inner surface of the equalizer 3 is covered with a metal mesh 31, and the metal mesh 31 is covered with a metal plate 32 with ventilation holes, and its upper and l...

Embodiment 2

[0025] Embodiment 2 Elastic and diversified cooling module system

[0026] Figure 3 is a schematic diagram of the structure of a splint condenser. The splint condenser 6 is composed of a splint 63 and a large number of fins 62 . The splint 63 is a double-sided or single-sided splint.

[0027] Fig. 4 is a schematic diagram of the integrated structure of the condensing fin and the temperature control fin. In order to improve the flexibility and accuracy of the system's temperature control, it can meet the requirements of the maximum heat transfer capacity of the system. The condensing splint 63 can be extended to the entire temperature equalizing circuit heat pipe device, and the temperature control fin 8 and the condensing fin 62 are arranged on the other side of the condensing splint 63, so that the temperature control fin 8 and the condensing fin 62 are integrated.

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Abstract

The present invention discloses a uniform temperature circuit heat pipe device, it includes circuit heat pipe device equipped with evaporator, condenser and temperature-balancing device, the temperature-balancing device is installed on the evaporating end of the circuit heat pipe device evaporator, the inner surface of the temperature-balancing device is coated with metal net, the metal net is embedded with metal plate with vent holes, the upper and lower surfaces of metal plate are equipped with bracing column, the temperature-balancing device is filled with liquid. The invention absorbs the good heat transfer property of prior circuit heat pipes, and increases temperature-balancing device, it can balance and disperse the high heat flow density concentrating point of electronic chip quickly to reduce the surface temperature of chip, so the application of chip can be expanded to the operations in higher accumulating and gathering degree and higher speed. It changes condense mode on the base of combining the temperature-balancing device and the circuit heat pipe device, the temperature control fins and the condensation fins are used in combing mode to improve the flexibility and accuracy of system to the temperature control.

Description

technical field [0001] The invention relates to the field of heat transfer and cooling of electronic devices, in particular to a heat pipe device for a temperature equalizing loop. Background technique [0002] The loop heat pipe is a new type of two-phase high-efficiency heat transfer device. It uses the capillary force generated by the capillary core in the evaporator to drive the loop to operate, and uses the evaporation and condensation of the working fluid to transfer heat. The case transfers a large amount of heat. [0003] The evaporator of the loop heat pipe is in contact with the heat source, and a high-performance capillary wick (called the first liquid-absorbing wick) is installed inside the evaporator. The compensation chamber is connected to the evaporator, and the two are internally connected through another capillary wick (called the second liquid-absorbing wick). The condensation section is in direct contact with the cold source. The evaporation pipe conne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02H05K7/20
CPCF28D15/06F28D15/0266H01L23/427F28D15/046H01L2924/0002F28D15/043F28F13/00F28F1/20F28F1/30F28F1/124H01L2924/00
Inventor 吕树申金积德
Owner SUN YAT SEN UNIV
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