Ion implantation of cupper, nickel as pretreatment technique for electroless copper on surface of ceramics

A technology of ion implantation and ceramic surface, which is applied in the field of ion implantation of copper and nickel as a pretreatment process for electroless copper plating on ceramic surfaces. The surface of the copper layer is easy to oxidize and other problems, so as to achieve the effect of good appearance, improved plating efficiency and small porosity

Inactive Publication Date: 2007-07-25
CHINA UNIV OF MINING & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0019] There are deficiencies in the above-mentioned various methods, such as Mo-Mn and Al 2 o 3 The connection effect with AlN is not ideal, and bubbles are found at the glass/ceramic interface; the adhesion strength of the DBC method is low; it is difficult ...

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  • Ion implantation of cupper, nickel as pretreatment technique for electroless copper on surface of ceramics

Examples

Experimental program
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Embodiment 1

[0026] Embodiment 1: select Al for use 2 o 3 Ceramic, Al 2 o 3 Clean the ceramic surface, degrease and remove the dirt attached to the surface; then measure the surface roughness; the prepared ceramics are ion implanted in the ion implantation equipment; the selected ion implantation element is Cu, and the implantation parameters are: implantation energy 17KeV, Injection dose 3.6×10e 17 ions / cm 2 ; Place the injected ceramics in the electroless plating solution for direct electroless copper plating. The electroless copper plating is a conventional electroless copper plating process in the prior art, omitted.

[0027] Combining the two technologies of ion implantation and electroless plating, ion implantation is used to replace the existing chemical pretreatment process in the sense of electroless plating to complete the plating of the metal film on the ceramic surface. The ion implantation equipment is a multifunctional ion implantation enhancement equipment, which is a ...

Embodiment 3

[0029] Example 3: The element selected for ion implantation is copper, and the range of implantation parameters is: implantation energy 10KeV, implantation dose 4.2×10e 17 ions / cm 2 ; The injected ceramics are placed in the electroless plating solution for direct electroless iron plating. Others are the same as embodiment 1, omitted.

Embodiment 4

[0030] Example 4: The element selected for ion implantation is nickel, and the range of implantation parameters is: implantation energy 10KeV, implantation dose 4.2×10e 17 ions / cm 2 ; The injected ceramics are placed in the electroless plating solution for direct electroless iron plating. Others are the same as embodiment 1, omitted.

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Abstract

This invention discloses a method for ion implantation of Cu, Ni or Fe as pretreatment process for chemical deposition on ceramic surface. The method comprises: cleaning ceramic surface, placing cleaned in an ion implantation apparatus, vacuumizing, cleaning the workpiece by gas sputtering, performing ion implantation by using Cu, Ni or Fe at an amount of 0.2*10e17-4.2*10e17 ions/cm2 and an energy of 6-30 keV, and placing the implanted ceramic in chemical deposition solution for chemical plating of Cu, Ni or Fe. This invention combines ion implantation and chemical deposition, and utilizes ion implantation to form a layer of metal identical to that to be deposited. Therefore, the formed deposition layer has such advantages as high uniformity, low porosity, good appearance, and high adhesiveness with the matrix. The method has such advantages as simple process, no secondary pollution, no need for implantation of noble metals, and high deposition efficiency.

Description

technical field [0001] The invention relates to a pretreatment process for electroless copper plating on ceramic surfaces, in particular to a pretreatment process for ion implantation of copper and nickel as electroless copper plating on ceramic surfaces. Background technique [0002] Ceramics have been widely used due to their excellent properties such as high strength, high wear resistance, high insulation, high chemical stability and low thermal expansion coefficient, but ceramics have low mechanical strength, brittleness, poor thermal stability, and are not easy to weld. Metallization of the ceramic surface can make it have the advantages of both ceramics and metals, and obtain ceramic-metal composite materials with special properties. Ceramic surface metallized composite materials are used in vacuum electronic devices, and new ceramic-metal composite materials have been applied to various technical fields such as semiconductors and integrated circuits, microwave devices...

Claims

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Application Information

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IPC IPC(8): C04B41/88
Inventor 孙智王晓虹康学勤王振中
Owner CHINA UNIV OF MINING & TECH
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