Storage device amd method for forming storage
A memory and storage line technology, applied in static memory, digital memory information, manufacturing/processing of electromagnetic devices, etc., to achieve the effects of reducing cross-interference, reducing writing current, and reducing distance
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[0030] In order to make the above objects, features and advantages of the present invention more comprehensible, a preferred embodiment will be described in detail below together with the accompanying drawings.
[0031] FIG. 4 shows a cross-sectional view of an early stage of a manufacturing process. As shown in FIG. 4, the device includes a substrate 110 having a dielectric layer 112 formed thereon, a series of wires 114-117, an insulating layer (separator layer) 122, an electrode layer 124, and a magnetoresistive layer 126. .
[0032] The substrate 110 may be a semiconductor substrate, such as a P-type silicon wafer with a lattice surface . The substrate 110 also includes any other suitable semiconductor material, such as gallium arsenide (GaAs), indium phosphide (InP), silicon carbide (SiC) or silicon / germanium (Si / Ge). The substrate 110 also includes active devices or circuits formed in front-end-of-line (FEOL), not shown here.
[0033] In one embodiment, the substrate ...
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