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Sparkle ball holding structure of connector

A technology of connectors and solder balls, applied in the direction of welding/welding connection, contact parts, etc., can solve the problems of circuit board warpage, incomplete flatness, open welding, etc., and achieve the best welding effect

Inactive Publication Date: 2008-06-04
林乐贤
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, as shown in accompanying drawings 2 and 4, the flatness of the surface of the plate-shaped circuit board 4 cannot be maintained in an accurate and flat situation, and sometimes the surface of the circuit board 4 may be a little rough due to temperature or load. Incomplete flatness such as warping
For the unevenness of the surface of the circuit board 4, the unevenness will cause the phenomenon that the surface of the circuit board 4 and the solder ball 3 cannot be fully contacted. The solder ball 3A will form a gap with the concave surface 41 and cannot contact
Therefore, during soldering, these solder balls 3A are not in contact with the surface of the circuit board 4, which will cause a bad situation of open soldering.

Method used

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  • Sparkle ball holding structure of connector
  • Sparkle ball holding structure of connector
  • Sparkle ball holding structure of connector

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Embodiment Construction

[0028] The following descriptions are only preferred embodiments of the present invention, and therefore do not limit the protection scope of the present invention.

[0029] See accompanying drawings 5 ​​to 9 : the connector B of the present invention still includes an insulating base 1 , a plurality of terminals 2 , and a plurality of solder balls 3 .

[0030] A plurality of terminal slots 11 penetrate through the insulating base body 1 along its vertical direction. Each terminal 2 is inserted in each terminal slot 11; the upper end of these terminals 2 forms a contact portion 21, and the lower end forms a welding portion 22; the contact portion 21 is of elastic structure, crimped and electrically contacted with an electronic component ( (not shown in the figure); the welding portion 22 extends downward and protrudes from the bottom of the terminal slot 11 . A plurality of solder balls 3 in a spherical state are placed between the insulating base body 1 and each soldering po...

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Abstract

The invention discloses a holding structure for tin ball catcher of connector, which comprises: an insulation base with barrier wall, a plurality of terminals with horizontal tin ball catch hole of open-cone shape on welding part, and multiple tin balls with part located by catch hole and limited by opposite barrier wall and up-and-down slide properly. Wherein, the hole diameter of catch hole is larger a little than the outside diameter of tin ball to catch the ball with a little loose; when welding the connector and circuit board, all tin balls slide up-and-down along contacted board surface to regulate contact evenly and achieve optimal welding effect.

Description

Technical field: [0001] The invention relates to the technical field of connectors, in particular to a grasping structure of a connector. Background technique: [0002] With the advancement of electronic circuits, the number of digits of data processing is getting higher and higher, and the speed is getting faster and faster, so the related connectors have more and more terminal pins. Therefore, the connector composed of many terminal pins plays an important role. [0003] However, the connector with many terminal pins requires soldering technology to be soldered on the circuit board, and when it is applied to surface mount (SMT), it often has a bad situation of open soldering, so it is necessary to improve this open soldering. Adding a solder ball to the soldering part of the terminal of the connector is a solution that has been developed, among which there are two methods of pre-solder ball or embedded solder ball. [0004] As shown in accompanying drawings 1 to 4, a com...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/02H01R4/02
Inventor 林乐贤
Owner 林乐贤
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