Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Radiation tolerance by clock signal interleaving

a clock signal and clock signal technology, applied in the field of fabrication and design of semiconductor chips and integrated circuits, can solve the problems of large number of cells, difficult computer-aided design, and complicated connections between cells, and achieve the effect of increasing radiation toleran

Inactive Publication Date: 2012-09-18
IBM CORP
View PDF16 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a logic structure for an integrated circuit that has increased radiation tolerance. This means that the circuit can better withstand damage caused by radiation, which can lead to soft errors in the circuit. The logic structure also reduces soft errors caused by clock distribution network upsets. Additionally, the logic structure does not excessively increase requirements for the clock distribution network. The method for designing the integrated circuit involves assigning circuits to different clock distribution nodes based on their radiation tolerance requirements. The invention can be used in various types of circuits such as storage arrays or register files.

Problems solved by technology

An IC may include a very large number of cells and require complicated connections between the cells.
Due to the large number of components and the details required by the fabrication process for very large scale integrated (VLSI) devices, physical design is not practical without the aid of computers.
While these techniques provide adequate placement of cells with regard to their data interconnections, power and timing, there is an additional challenge for the designer in constructing a circuit that is resistant to soft errors, and this challenge is becoming more difficult with the latest technologies like 65-nanometer application-specific integrated circuits (ASICs).
Soft errors are caused by, e.g., alpha particle strikes emitted from packaging materials or by neutrons originating from cosmic radiation.
All storage elements (random-access memory, latches, etc.) are highly susceptible to soft-error induced failures, but memory arrays are usually protected by error-correction codes while latches are usually not so protected.
However, the values can be upset during operation due to soft errors.
An upset may be correctable by scanning in a new value, but systems may only allow input scanning in a limited manner such as at power-on, meaning that the system must be restarted if a clock control latch becomes incorrectly set.
These reliability problems are particularly troublesome for harsher operating environments, such as aerospace systems where there is increased radiation (high-altitude or orbital space).
Design parameters used to optimize circuits for terrestrial applications can actually be detrimental to radiation tolerance.
Placers which try to minimize area will place many critical components closer to one another, making it more likely that a particle strike will cause multiple upsets.
Even if ASIC logic book data nets are hardened, upsets in the clock trees may still lead to logical upsets in the books, e.g., when an incorrect data value is captured at a latch due to a faulty clock signal.
This clock input is shared among several ASIC logic books, so an upset in the clock signal can lead to multiple latches sampling incorrect data.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radiation tolerance by clock signal interleaving
  • Radiation tolerance by clock signal interleaving
  • Radiation tolerance by clock signal interleaving

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

)

[0026]With reference now to the figures, and in particular with reference to FIG. 1, there is depicted one embodiment 10 of a computer system in which the present invention may be implemented to carry out the design of logic structures in an integrated circuit. Computer system 10 is a symmetric multiprocessor (SMP) system having a plurality of processors 12a, 12b connected to a system bus 14. System bus 14 is further connected to a combined memory controller / host bridge (MC / HB) 16 which provides an interface to system memory 18. System memory 18 may be a local memory device or alternatively may include a plurality of distributed memory devices, preferably dynamic random-access memory (DRAM). There may be additional structures in the memory hierarchy which are not depicted, such as on-board (L1) and second-level (L2) or third-level (L3) caches.

[0027]MC / HB 16 also has an interface to peripheral component interconnect (PCI) Express links 20a, 20b, 20c. Each PCI Express (PCIe) link 20a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for designing integrated circuits uses clock signal interleaving to reduce the likelihood of a soft error arising from an upset in a clock distribution network. At least two circuits in a circuit description are identified as being sensitive to radiation, and different clock distribution nodes are assigned to the two circuits. Several exemplary implementations are disclosed. The second circuit may be a redundant replica of the first circuit, such as a reset circuit. The first and second circuits may be components of a modular redundant circuit such as a triple modular redundancy flip-flop. The first circuit may include a set of data bits for an entry of a storage array such as a register or memory array, and the second circuit may include a set of check bits associated with the entry.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention generally relates to the fabrication and design of semiconductor chips and integrated circuits, and more particularly to a method of designing the netlist connections of latches and other logic cells to improve radiation tolerance.[0003]2. Description of the Related Art[0004]Integrated circuits are used for a wide variety of electronic applications, from simple devices such as wristwatches to the most complex computer systems. A microelectronic integrated circuit (IC) chip can generally be thought of as a collection of logic cells with electrical interconnections between the cells, formed on a semiconductor substrate (e.g., silicon). An IC may include a very large number of cells and require complicated connections between the cells. A cell is a group of one or more circuit elements such as transistors, capacitors, resistors, inductors, and other basic circuit elements grouped to perform a logic fu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(United States)
IPC IPC(8): G06F17/50
CPCG06F17/505G06F2217/62G06F30/327G06F30/396
Inventor ELLAVSKY, MATTHEW R.KLEINOSOWSKI, AJWILLENBORG, SCOTT M.
Owner IBM CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products