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Printed board and manufacturing method thereof

a printing board and manufacturing method technology, applied in the field of printed boards, can solve the problems of high heat generation of electronic components, such as transistors and integrated circuits, packaged on printed boards, and achieve the effects of excellent heat generation characteristic, easy manufacturing, and excellent heat radiating characteristi

Inactive Publication Date: 2009-01-20
U AI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005]To solve the above-mentioned problem, an object of the present invention is to provide a printed board that can cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device, and a method for manufacturing such a printed board with efficiency.Means for Solving the Problem
[0045]According to the printed board manufacturing method of the present invention, the board-shaped carbon containing member is a member obtained by filling a gap in a network knitted from a heat conductive material with a material principally made of carbon. Therefore, the weak carbon-to-carbon bonds are reinforced with the network. This is advantageous in that carbon flakes can effectively be prevented from dropping off from the carbon containing member, thereby reducing the rate of occurrence of faulty wiring in the manufactured printed board.

Problems solved by technology

Electronic components, such as a transistor and an integrated circuit (IC), packaged on a printed board generate high heat when energized.

Method used

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  • Printed board and manufacturing method thereof
  • Printed board and manufacturing method thereof
  • Printed board and manufacturing method thereof

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first embodiment

[0079]Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a top view of a printed board 1 according to the present invention. FIG. 2 is a sectional side view taken along line II-II of FIG. 1. In FIGS. 1 and 2, the printed board 1 is partially omitted. In FIG. 1, an electronic component 2 is not shown and its imaginary outline is shown using a chain double-dashed line.

[0080]The printed board 1 is, for example, a board included in an electronic device such as an engine control unit (ECU). It principally includes a plurality of electronic components 2 packaged on an upper surface thereof (toward a viewer from paper surface of FIG. 1, upper side in FIG. 2), a conductive pattern 3 for coupling these electronic components 2, an insulating board 4 on whose at least one surface (upper surface of the insulating board 4 in FIG. 2) the conductive pattern 3 is formed, and a carbon sheet 5 provided inside the insulating bo...

second embodiment

[0149]Similarly in the carbon sheet 50 used in the second embodiment, the carbon containing material 50a filling the network knitted from the copper wire 50b may be made of only carbon or a mixture of carbon and other materials.

[0150]Further, in the carbon sheet 50 used in the second embodiment, the network knitted from the copper wire 50b is filled with the carbon containing material 50a. However, the member forming the network is not limited to the copper wire 50b. As a matter of course, it can be presumed that the copper wire 50b can be replaced with a material having heat conductivity. For example, a metal wire such as a silver wire may be used instead of the copper wire 50b. Further, the mesh form of the network is not limited to the knit form shown in FIG. 6. As a matter of course, it can be presumed that the network can take other mesh forms.

[0151]Further, as the method for manufacturing the printed board 1 according to the above-mentioned first embodiment, the method for man...

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Abstract

A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.

Description

TECHNICAL FIELD[0001]The present invention relates to a printed board and a manufacturing method thereof. In particular, the invention relates to a printed board that can cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device, and a method for manufacturing such a printed board.BACKGROUND ART[0002]Electronic components, such as a transistor and an integrated circuit (IC), packaged on a printed board generate high heat when energized. Therefore, methods for cooling heat generated by these electronic components have been important technologies in the field of electronic devices (for example, engine control unit for an automobile (ECU)). A typical one of methods for cooling an electronic component is a method for mounting a heatsink made of a material having excellent heat conductivity on a surface of the electronic component to be heated (see Patent Document 1). There is als...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01R12/00
CPCH05K1/0207H05K3/4641H05K1/0206H05K1/056H05K3/4069Y10T29/49128H05K2201/0323H05K2203/1152Y10T29/49165H05K3/42H05K3/44H05K3/46H05K7/20
Inventor TAKEZAKI, MASANORIKOMARU, MASAYUKINITTA, HARUKIYAGI, TAKAFUMIMIZUNO, YOSHIYUKI
Owner U AI ELECTRONICS
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