Heat-curable resin composition for semiconductor encapsulation

Abstract

Provided is a versatile heat-curable resin composition for semiconductor encapsulation that has a favorable water resistance and abradability, and exhibits a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-size wafer.The heat-curable resin composition of the invention contains:(A) a cyanate ester compound having not less than two cyanato groups in one molecule;(B) a phenol curing agent containing a resorcinol-type phenolic resin;(C) a curing accelerator; and(D) a spherical inorganic filler.

Description

BACKGROUND OF THE INVENTION[0001]Field of the Invention[0002]The present invention relates to a heat-curable resin composition for semiconductor encapsulation; and a semiconductor device encapsulated by such resin composition.[0003]Background Art[0004]In recent years, semiconductor devices have undergone a tremendous technical innovation. In order for mobile information-communication terminals such as smart phones and tablets to be able to process a large volume of information at a high speed, a TSV (Through Silicon Via) technology is employed to connect semiconductor elements through multi-layer bonding, followed by performing flip chip bonding on the multilayered semiconductor elements on an 8-inch or 12-inch silicon interposer, and then using a heat-curable resin to encapsulate each interposer with a plurality of the multilayered semiconductor elements mounted thereon. The encapsulated package is then divided after abrading the unwanted cured resin on the semiconductor elements, ...

AI Technical Summary

Benefits of technology

The present invention provides a heat-curable resin composition for semiconductor encapsulation that has good water resistance, abrasion, and flow properties, and low warping when used on large wafers. The composition can be used to make semiconductor devices with superior heat and moisture resistance, and barely show warping after cooling. Additionally, the composition enables collective encapsulation of whole wafers, and allows for easy abrasion and dicing of the encapsulation resin.

Problems solved by technology

However, an epoxy resin or the like tends to exhibit a significant contraction stress after encapsulation, in the case of performing molding on a wafer of a size of not smaller than 12 inches, on a 20-inch wafer in recent years or on a panel of a size of larger than 20 inches.

For this reason, there has been a problem that a semiconductor element(s) will be stripped off from a substrate made of a metal or the like in such case, which makes it impossible to conduct mass production.

However, in the case where an entire silicon interposer is to be encapsulated by a heat-curable resin, a significant warpage will occur due to a difference in thermal expansion coefficient between the silicon and heat-curable resin.

A significant warpage makes it unsuitable to perform an abrading step and a dicing step later.

That is, it has been a major technical issue to prevent warpage.

This type of composition bears a problem that a warpage will change due to a thermal history associated with a step(s) in 3D packaging, and that such warpage will then lead to damages of a semiconductor(s) or even the breakage of a wafer itself.

Meanwhile, since a typical low-elastic resin material such as a conventional silicone compound is a soft resin, there have been problems that the soft resin will lead to resin clogging when being abraded, and that resin cracks will occur during a reliability test (JP-A-Hei11-289034).

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