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Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate

a technology of laminate body and printed wiring board, which is applied in the direction of film/foil adhesives, transportation and packaging, synthetic resin layered products, etc., can solve the problems of reducing resin strength, increasing the content of filler, and reducing insulation reliability, so as to prevent warping, reduce thermal expansion coefficient, and reduce the effect of filler conten

Active Publication Date: 2013-05-09
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention provides a laminate plate and a multilayer laminate plate that have low thermal expansion and high elastic modulus, which can prevent warping and cracking. Additionally, the invention also provides a laminate body that is suitable for producing the laminate plate and the multilayer laminate plate. Furthermore, the invention offers a printed wiring board that uses the laminate plate and the multilayer laminate plate. The method for producing the laminate plate is also included in the invention.

Problems solved by technology

However, it is known that increasing the inorganic filler content results in insulation reliability degradation, adhesiveness failure between resin and the wiring layer to be formed on the surface thereof, and pressing failure in laminate plate production, and increasing the filler content is therefore limited.
However, increasing the crosslinking density is to shorten the molecular chain between functional groups, but shortening the molecular chain to a level overstepping a certain threshold is limitative in view of the reactivity of the resin, and may often bring about a problem in that the resin strength would be lowered.
Consequently, there is also a limit on lowering the thermal expansion coefficient according to the method of increasing the crosslinking density.
As in the above, for conventional laminate plates, lowering the thermal expansion coefficient thereof and increasing the elastic modulus thereof have heretofore been tried by increasing the fill ration of the inorganic filler therein and by employing a resin having a low thermal expansion coefficient; however, these are being pushed to the limit.
As a method differing from the above, there has been made a trial of using a glass film as a layer having a thermal expansion coefficient almost the same as the thermal expansion coefficient of electronic parts (silicon chips) and laminating a resin on the glass film by pressing to thereby reduce the thermal shock stress of the resulting laminate (Patent Reference 4); however, the elastic modulus of the resin layer is low and the thermal expansion coefficient thereof is high, and therefore the method is insufficient for realizing the reduction in the warp of substrate.

Method used

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  • Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
  • Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
  • Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate

Examples

Experimental program
Comparison scheme
Effect test

example 1

Production of Resin Film 3 (Laminate of Interlaminar Insulation Composition Layer 2 and Support Film 1)

[0154]To 135.4 parts of a polyamide resin, Nippon Kayaku's “BPAM-155” (product name) dissolved in a dimethylacetamide solvent to have a concentration of 10%, added were 62.0 parts of an epoxy resin, Nippon Kayaku's “NC3000-H” (product name, concentration 100%) as a thermosetting resin, 23.5 parts of a triazine-containing phenolic novolak resin, DIC's “LA-1356-60P” (product name, concentration 60%) as a curing agent, 0.6 parts of 2-phenylimidazole, Shikoku Chemical Industry's “2PZ” (product name, concentration 100%) as a curing promoter, 8.8 parts of fumed silica, Nippon Aerosil's “AEROSIL R972” (product name, concentration 100%; mean particle diameter of primary particles, 16 nm; specific surface area according to BET method, 110±20 m2 / g) as an inorganic filler, and 3.6 parts of a polyester-modified polydimethylsiloxane, BYK Chemie Japan's “BYK-310” (product name, concentration 25%...

example 2

Production of Adhesive Film 5b (Support Film / Interlaminar Insulation Composition Layer / Resin Composition Layer)

[0161]An adhesive film 5b of 250 mm×250 mm was produced according to the same process as that for the adhesive film 5a in Example 1, except that the coating thickness of the varnish was changed from 20 μm to 40 μm (as so defined that the interlaminar insulation composition layer 2 could be 5 μm, and the resin composition layer 4 could be 35 μm).

[0162]A five-layered laminate plate (interlaminar insulation layer / cured resin layer / glass substrate layer / cured resin layer / interlaminar insulation layer) was produced according to the same process as in Example 1 except that the above-mentioned adhesive film 5b was used in place of the adhesive film 5a.

example 3

Production of Laminate Plate (Interlaminar Insulation Layer / Cured Resin Layer / Interlaminar Insulation Layer / Cured Resin Layer / Glass Substrate Layer / Cured Resin Layer / Interlaminar Insulation Layer / Cured Resin Layer / Interlaminar Insulation Layer)

[0163]As the glass substrate layer, used here was an ultrathin glass film, Nippon Electric Glass's “OA-10G” (product name, thickness 100 μm; 250×250 mm). On both surfaces of the glass substrate, the adhesive film 5b was so arranged that its cured resin layer could face the glass substrate, and laminated using a batch-type vacuum pressure laminator “MVLP-500” (Meiki's product name). In this stage, the vacuum degree was at most 30 mmHg, the temperature was 90° C., and the pressure was 0.5 MPa. After cooled to room temperature, the support film was peeled off.

[0164]On the interlaminar insulation composition layer which was exposed as a result of the peeling off of the support film, the above-mentioned adhesive film 5b was so arranged that its cur...

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Abstract

A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate comprising a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.

Description

TECHNICAL FIELD[0001]The present invention relates to a laminate body and a laminate plate suitable for use in semiconductor packages and printed wiring boards, to a printed wiring board and multilayer laminate plate using the laminate plate, and to a method for producing the laminate plate.BACKGROUND ART[0002]Recently, the demand for thinner and lighter electronic instruments has become increasingly greater, and thinning and densification of semiconductor packages and printed wiring boards has been promoted. For stably packaging electronic parts with satisfying the demand for thinning and densification thereof, it is important to prevent the warping to occur in packaging.[0003]In packaging, one reason for the warping to occur in semiconductor packages is the difference in the thermal expansion coefficient between the laminate plate used in a semiconductor package and the silicon chips to be mounted on the surface of the laminate plate. Accordingly, for the laminate plate for semico...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B17/06H05K1/03
CPCB32B17/064H05K1/0306Y10T428/266H05K1/036H05K1/0373B32B2307/54B32B17/10Y10T428/31601Y10T428/31612Y10T428/31616Y10T428/31623Y10T428/31627Y10T428/31645
Inventor AOSHIMA, MASAHIROTAKAHASHI, YOSHIHIROYAMAZAKI, YUKAKAMIGATA, YASUOMURAI, HIKARI
Owner RESONAC CORP
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