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Electroplating in presence of co2

a technology of electroplating and co2 is applied in the field of electroplating in presence of co2, which can solve the problems of pipe blockage, difficult separation between cosub>2 /sub>and the plating solution, and severe restrictions on the technique, and achieves excellent metal films and excellent ability to emulify co2. , the effect of improving the efficiency of the electroplating reaction

Inactive Publication Date: 2007-08-02
DAIKIN IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0077] In the present invention, the efficiency of an electroplating reaction can be improved and excellent metal films can be formed by using a nonionic compound having a CO2-affinitive moiety, the nonionic compound having an excellent ability to emulsify CO2 with an aqueous solution of an electrolyte (e.g., metal salt), which is a plating solution, having an excellent ability to remove or defoam bubbles formed during operations, and having a preferable wettability between a substrate, plating solution and CO2. Furthermore, the present invention can simplify the preprocessing and postprocessing conducted before and after plating and significantly improve throughput.
[0078] Use of the nonionic compound of the present invention achieves prompt separation between carbon dioxide and a metal-containing aqueous solution after stirring. This reliably prevents the problems of known techniques, such as bubbles of a metal-containing aqueous solution and carbon dioxide entering pipes and metal salts clogging pipes.
[0079] Furthermore, because the nonionic compound of the present invention exhibits a cleaning ability in supercritical carbon dioxide, it is effective for degreasing conducted prior to plating and washing conducted after plating. Therefore, the present invention greatly contributes to reducing alkaline and acidic waste liquids produced during preprocessing and metal waste liquids produced during washing in postprocessing, which are serious problems in prior art techniques.

Problems solved by technology

However, we reexamined this technique in detail and found that, in order to obtain excellent plated films without pinholes, this technique requires severe restrictions on the conditions for conducting plating, including the selection of a surfactant.
Furthermore, because of its considerable water solubility, a large amount of the polyoxyethylene compound used is also dissolved in a plating solution.
Therefore, separation between the CO2 and the plating solution does not easily progress in the plating bath after plating.
This causes the formation of many bubbles containing the surfactant and plating solution during postprocessing decompression, and the resultant bubbles enter pipes, etc., causing pipes to become clogged.
This problem significantly reduces efficiency in terms of throughput when such techniques are put into practical use.
These surfactants are required to have chemical stability under electrochemical conditions in a plating bath; however, no full examination has been conducted concerning this stability until now.
Furthermore, concerning this supercritical plating technique, no information exists regarding the relationship between the type of surfactant used and the plating ease or resulting plated film.

Method used

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  • Electroplating in presence of co2
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  • Electroplating in presence of co2

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0185]FIG. 1 illustrates the apparatus used in the Examples of the present invention. In a 50 cm3 high-pressure container 8 were placed 20 cm3 of nickel plating bath (Watt bath comprising 280 g / L nickel sulfate, 60 g / L nickel chloride, 50 g / L boric acid, and a brightener (q.s.)) and 0.3 wt % of F(CF(CF3)CF2O)3CF(CF3)COO(CH2CH2O)2CH3 relative to the nickel plating bath. After attaching a degreased brass plate to the cathode and pure nickel plate to the anode (both having a surface area of 4 cm2), the high-pressure container 8 was sealed, and then heated to 50° C. in a thermostat 4. CO2 was filled in the container using a liquid feeding pump 3 and pressure regulator 10 until the pressure reached 10 MPa. Nickel plating was conducted by stirring the CO2-plating solution by rotating a rotor 6 at 500 rpm using a stirrer 5, and passing an electric current at 5 A / dm2 for 6 minutes. After completion of electric current passage, the high-pressure container 8 was subjected to decompression, th...

example 2

[0186] Plating was conducted in the same manner as Example 1 except that H(CF2)6COOCH2CH3 was used as a nonionic compound having a CO2-affinitive moiety.

[0187]FIG. 3 shows scanning electron microscope photographs.

example 3

[0188] Plating was conducted in the same manner as Example 1 except that F(CF2)6(CH2)10H was used as a nonionic compound having a CO2-affinitive moiety.

[0189]FIG. 4 shows scanning electron microscope photographs.

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Abstract

The present invention provides a method for conducting electroplating in the presence of CO2 and a metal salt-containing aqueous solution, wherein the CO2 is in the form of liquid, subcritical or supercritical, the method being characterized in that a nonionic compound having a CO2-affinitive moiety is further added to the system where the aqueous solution and CO2 coexist. The method of the present invention improves the efficiency of the electrochemical reaction process and enables formation of an excellent metal film.

Description

TECHNICAL FIELD [0001] The present invention relates to an environmental technology using CO2 as an alternative to conventional solvent. More specifically, the present invention relates to a technique for improving the efficiency of electrochemical reaction by using CO2 as a solvent, and an electroplating technique employing such technique. BACKGROUND OF THE INVENTION [0002] Because of manifestation of various environmental problems, techniques using CO2 as a solvent instead of toxic organic solvents have been attracting public attention. If compounds can be handled in CO2, the cost for treating waste water may be significantly reduced, and therefore the idea of putting a such technique to practical use has been receiving particular attention in dying, plating and like industries which suffer from high waste water treatment costs. Having this as a technical background, a technique wherein CO2 and a metal salt-containing aqueous solution are suspended while stirring, and then electro...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C25D5/00B01J3/00C25D3/02
CPCC25D5/003C25D3/02
Inventor NAGAI, TAKABUMIFUJII, KAZUHISAASAI, HIDEAKI
Owner DAIKIN IND LTD
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