Semiconductor device and method of manufacturing the same

Abstract

Disclosed is a method for manufacturing a semiconductor device comprising implanting ions of an impurity element into a semiconductor region, implanting, into the semiconductor region, ions of a predetermined element which is a group IV element or an element having the same conductivity type as the impurity element and larger in mass number than the impurity element, and irradiating a region into which the impurity element and the predetermined element are implanted with light to anneal the region, the light having an emission intensity distribution, a maximum point of the distribution existing in a wavelength region of not more than 600 nm.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2002-113570, filed Apr. 16, 2002, the entire contents of which are incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a semiconductor device and a semiconductor device manufacturing method and, more particularly, to a thermal annealing technology. [0004] 2. Description of the Related Art [0005] High integration of LSIs has been achieved by reducing sizes of elements constructing LSIs. With decreasing dimensions of elements, the formation of a shallow p-n junction, i.e., the formation of a shallow impurity diffusion region is becoming important. [0006] To form this shallow impurity diffusion region, ion implantation at low acceleration energy and optimization of subsequent annealing are important. Boron (B) is used as a p-type impurity, and pho...

AI Technical Summary

Benefits of technology

The present invention provides methods for manufacturing semiconductor devices by implanting ions of an impurity element and a predetermined element, and then annealing the region using light. The light has a specific emission intensity distribution, and the method results in improved device performance and stability. Additionally, the invention provides a semiconductor device with a first semiconductor region and a second semiconductor region containing an impurity element and a predetermined element, where the predetermined element has a specific density distribution in a depth direction. This results in improved device performance and stability as well.

Problems solved by technology

However, these Impurities have larger diffusion coefficients in silicon (Si).

This gradually makes it difficult to obtain a shallow impurity diffusion layer.

By RTA using a halogen lamp, therefore, it is difficult to form an impurity diffusion layer having a shallow (about 20 nm or less) junction and low resistance.

Unfortunately, the light of the flash lamp is reflected by the surface of a semiconductor substrate to worsen the heating efficiency.

This makes sufficient impurity activation difficult.

If the irradiation energy of the flash lamp is increased to raise the activation ratio, the thermal stress increases, and this destroys the semiconductor substrate.

That is, the conventional flash lamp annealing method can form an impurity diffusion region having a shallow junction but cannot unlimitedly lower the resistance of the diffusion layer.

Since, however, the light-absorbing film formed on the surface of a gate insulating film is used, efficient heating is difficult to perform.

However, the use of the light-absorbing film formed on the surface of an interlayer insulating film also makes efficient heating difficult.

However, accurately controlling the impurity profile is conventionally difficult.

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