Method of manufacturing dielectric layer of grid
A technology of gate dielectric layer and manufacturing method, which is applied in the field of semiconductor element manufacturing, can solve the problems of reduced process yield, increased power consumption, and reduced component stability and reliability, so as to improve reliability and stability, prevent Effects of Junction Leakage and Avoidance of Thinning Phenomenon
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[0046] Figure 2A to Figure 2F To illustrate a cross-sectional view of a manufacturing process of a gate dielectric layer according to a preferred embodiment of the present invention.
[0047] Please refer to Figure 2A In this manufacturing method, for example, the substrate 200 is provided first, and the substrate 200 can be at least divided into a high-voltage circuit area 201 and a low-voltage circuit area 202. Then take, for example, RCA solution (ammonia NH 4 OH and hydrogen peroxide H 2 O 2 The mixed solution of) performs a cleaning step on the substrate 200. After that, a dielectric layer 210 is formed on the substrate 200. The dielectric layer 210 is used as the gate dielectric layer in the high-voltage circuit area 201, so the thickness of the dielectric layer 210 is thicker than the conventional pad oxide layer, and the thickness of the dielectric layer 210 is about 200-1000 angstroms. The method of forming the dielectric layer 210 is, for example, a thermal oxidation m...
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