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Light-sensitive transfer sheet, light-sensitive layers, method for forming image pattern and method for distribution pattern

A technology for transferring thin sheets and photosensitive layers, which can be used in photosensitive material processing, microlithography exposure equipment, photoplate making process of patterned surface, etc., and can solve problems such as cover film rupture

Inactive Publication Date: 2005-07-20
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as mentioned above, the cured layer of the photosensitive layer has the function of protecting the through hole or via hole formed on the printed circuit board. The problem of cracking of the masking film in the process of the uncured area of ​​the resin composition and the process of etching the exposed metal layer part

Method used

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  • Light-sensitive transfer sheet, light-sensitive layers, method for forming image pattern and method for distribution pattern
  • Light-sensitive transfer sheet, light-sensitive layers, method for forming image pattern and method for distribution pattern
  • Light-sensitive transfer sheet, light-sensitive layers, method for forming image pattern and method for distribution pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0298] (Formation of the first photosensitive layer)

[0299] On a polyethylene terephthalate film having a thickness of 20 µm, a first photosensitive resin composition solution composed of the following components was coated and dried to form a first photosensitive layer having a thickness of 25 µm.

[0300] The first photosensitive resin composition solution

[0301] Methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymer composition (molar ratio): 55 / 11.7 / 4.5 / 28.8 mass average molecular weight: 90,000, Tg: 70 °C) 15 parts by mass

[0302] 1 / 2 molar ratio adduct of 1,6-hexamethylene diisocyanate and octaoxirane mono(meth)acrylate 8 parts by mass

[0303] 0.04 parts by mass of 4,4'-bis(diethylamino)benzophenone

[0304] Benzophenone 1.0 parts by mass

[0305] 0.5 parts by mass of 4-toluenesulfonamide

[0306] Malachite green oxalate 0.02 parts by mass

[0307] 1,2,4-triazole 0.01 parts by mass

[0308] Leuco gentian violet 0....

Embodiment 2

[0340] (Synthesis example of polyvinyl alcohol derivative)

[0341] 10 parts by mass of polyvinyl alcohol (PVA205 manufactured by Kuraray Co., Ltd.) was dissolved in 90 parts by mass of water. A solution of 2.3 parts by mass of methylolacrylamide dissolved in 20.7 parts by mass of water and 0.002 parts by mass of hydroquinone were added thereto. Further, 0.04 parts by mass of sulfuric acid was added thereto and reacted at 40°C for 4 hours to obtain a 10% by mass aqueous solution of polyvinyl alcohol having an acrylamide group in the side chain.

[0342] (Production of photosensitive transfer sheet)

[0343] A photosensitive transfer sheet was obtained in the same manner as in Example 1 except that the barrier layer solution in Example 1 was changed to the following.

[0344] Barrier solution

[0345] 130 parts by mass of a 10% aqueous solution of a synthetic polyvinyl alcohol derivative

[0346] 6 parts by mass of polyvinylpyrrolidone

[0347] Water 83 parts by mass

[0...

Embodiment 3

[0351] (Production of photosensitive transfer sheet)

[0352] A photosensitive transfer sheet was obtained in the same manner as in Example 1 except that the barrier layer solution in Example 1 was changed to the following.

[0353] Barrier solution

[0354] Polyvinyl alcohol (PVA205, manufactured by Kuraray Co., Ltd.) 13 parts by mass

[0355] 3 parts by mass of polyvinylpyrrolidone

[0356] 3 parts by mass of nonapropylene glycol diacrylate

[0357] 200 parts by mass of water

[0358] Methanol 180 parts by mass

[0359] The film thickness deviation of any layer is within ±5%. The sensitivity of the thus-obtained photosensitive transfer sheet was measured by the method described later. As a result, the shortest developing time was 30 seconds, and the light energy A required for curing the second photosensitive layer was 4 mJ / cm 2 , the light energy B required for curing the first photosensitive layer is 40mJ / cm 2 , the light energy C required until the first photosensi...

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Abstract

The purpose of the present application is the pattern can be easily formed on the desired pattern with different thickness inside the imagine. There is a photosensitive transcription sheet which is made by laminating the first photosensitive layer composed of the binder, polymerizable compounds, and photo polymerization initiators, the barrier lay containing the polymeric compound, then the second photosensitive layer composed of the binder, polymerizable compounds, and photo polymerization initiators which containing the photosevsity higher than that of the seond photosensitive lay. Further, there is a pattern formed by the the photosevsitive laminate which is made by laminating the second photosensitive layer composed of the binder, polymerizable compounds, and photo polymerization initiators, the barrier lay containing the polymeric compound, then the first photosensitive layer composed of the binder, polymerizable compounds, and photo polymerization initiators which containing the photosevsity higher than that of the seond photosensitive lay.

Description

technical field [0001] The present invention relates to a photosensitive transfer sheet, a photosensitive laminate, a method for forming an image pattern, and a method for forming a wiring pattern. In particular, the present invention relates to a photosensitive transfer sheet and a laminate useful for producing a wiring board, and a method for forming a wiring pattern of a printed wiring board using the photosensitive transfer sheet or the laminate. Background technique [0002] Photosensitive transfer sheets having a support and a photosensitive layer are being widely used in the manufacture of printed circuit boards, color filters and pillars, ribbed materials, spacers, partitions and other display components, printing plates, holograms, etc. Image pattern forming materials such as various image forming materials such as micromachines and proofs. [0003] In the field of manufacturing printed circuit boards, the wiring pattern is obtained by using a photosensitive transf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/028G03F7/032G03F7/09G03F7/095G03F7/11G03F7/20G03F7/26H05K3/06
CPCC08F2/50G03F7/0007G03F7/027G03F7/029G03F7/031G03F7/032G03F7/033G03F7/038G03F7/11G03F7/70291
Inventor 若田裕一佐藤守正
Owner FUJIFILM CORP
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