High molecular PTC thermistor without electric arc and method for producing same

A technology of thermistor and manufacturing method, applied in the direction of resistors with positive temperature coefficient, etc., can solve problems such as thermistor failure and chip damage, reduce arc discharge, improve safety and reliability, and increase creepage effect of distance

Inactive Publication Date: 2003-05-07
SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, the core material of the polymer PTC thermistor is a so-called "sandwich" structure, that is, two layers of metal foil electrodes sandwich a layer of polymer PTC material chip. When the thermistor is in the "off" state, the chip is at high In the state of resistance, the voltage between the two layers of electrode sheets increases. Because the chip is very thin, creepage phenomenon often occurs between the electrodes, and arc discharge occurs. In severe cases, the chip will be damaged and the thermistor will fail.

Method used

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  • High molecular PTC thermistor without electric arc and method for producing same
  • High molecular PTC thermistor without electric arc and method for producing same
  • High molecular PTC thermistor without electric arc and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] as table 1

[0016] high density

polyethylene

carbon black

Carbon black dispersant

Oxidized polyethylene

antioxidant

Triallyliso

Cyanurate

Titanium coupling agent

336

400

42

17

7

7

[0017] Note: High-density polyethylene: Phillips Petroleum Company BHB5012

[0018] Carbon black: Cabot XC-72

[0019] Antioxidant: American Great Lakes Chemical Co., Ltd. ANOX70

[0020] Its manufacturing method: in the first step, the components in Table 1 are mixed uniformly in an internal mixer at a temperature of 190 ° C, cooled, crushed and ground, and sandwiched between two layers of roughened copper foil. between them, put them in the compression mold, pressure 5Mpa, temperature 180℃, and press them into an area of ​​200cm 2 , 0.2mm thick sheet, such as figure 1 It is a schematic diagram of the composite sheet of this embodiment, wherein the nickel-plated copper foils 1 and 3 ar...

Embodiment 2

[0022] Table 2

[0023]

high density

polyethylene

carbon black

Carbon black dispersant

Oxidized polyethylene

Antioxidant

Triallyliso

Cyanurate

Titanium coupling agent

340

320

30

16

7

7

[0024] Note: High-density polyethylene: Phillips Petroleum Company BHB5012

[0025] Carbon black: Cabot XC-72

[0026] Antioxidant: American Great Lakes Chemical Co., Ltd. ANOX70

[0027] In the first step, the components in Table 2 were kneaded evenly in an internal mixer at a temperature of 190°C, cooled, pulverized and ground, sandwiched between two layers of roughened copper foil, and placed in a In the compression mold, the pressure is 5Mpa, and the temperature is 180°C, and the area is 200cm 2 , Thick 2.0mm sheet. like figure 1 It is a schematic diagram of the composite sheet of this embodiment, wherein the nickel-plated copper foils 1 and 3 are laminated on both s...

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PUM

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Abstract

The invented core material of the macromolecule PTC thermistor consists of the chip possessing the PTC characteristics and the metals foil electrodes pasted on the both sides of core material. The area of the electrode is smaller than the area of the chip. Comparing with the prior art, the etching technique and the stamping etc. techniques are adopted so as to realize the new structure of the PTC thermistor: the large chip and the small electrodes. The new structure increases the creepage distance between the electrodes, and reduces the arc discharging phenomena happened between the electrodes.

Description

technical field [0001] The invention is an electronic component manufacturing method and its products with conductive high molecular polymer composite material as the main raw material, especially relates to a high molecular PTC thermistor and its manufacturing method. Background technique [0002] Generally, a positive temperature coefficient (PTC) phenomenon can be exhibited in a crystalline or semi-crystalline polymer composite material filled with conductive particles. That is to say, within a certain temperature range, its own resistivity will increase with the increase of temperature. These crystalline or semicrystalline polymers include polyethylene, polypropylene, polyvinylidene fluoride, polychlorotrifluoroethylene, and copolymers thereof. Conductive particles include carbon black, graphite, carbon fiber, metal powder (such as silver powder, copper powder, aluminum powder, silver powder, stainless steel powder). At lower temperatures, such conductors exhibit low r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/02
Inventor 侯李明王军秦玉廷杨兆国潘昂李从武
Owner SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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