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Preparation method of self-heat-absorption reshapable ice extension/deicing microarray structure

A technology of microarray structure and microstructure, which is applied in the direction of liquid cleaning method, cleaning method and utensils, chemical instruments and methods, etc., can solve the problems of complex preparation process, difficult promotion, environmental pollution, etc., and achieve simple preparation method, Effects of reduced heat exchange rate and easy operation of the processing method

Active Publication Date: 2022-05-13
CHANGCHUN UNIV OF SCI & TECH
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method for preparing a self-absorbing heat-reforming ice-extending / deicing microarray structure to solve the problem of high cost and poor preparation process in the anti-icing or deicing methods in the prior art. Complicated, easy to cause environmental pollution, difficult to popularize and other technical problems

Method used

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  • Preparation method of self-heat-absorption reshapable ice extension/deicing microarray structure
  • Preparation method of self-heat-absorption reshapable ice extension/deicing microarray structure
  • Preparation method of self-heat-absorption reshapable ice extension/deicing microarray structure

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Embodiment Construction

[0037] A method for preparing a self-absorbing heat-recoverable ice-extending / de-icing microarray structure, comprising the following steps:

[0038] Step 1. Based on the working principle of the shape memory alloy, an array microstructure is prepared on the surface of the nickel-titanium NiTi shape memory alloy substrate 2 . Design principles such as Figure 5 As shown: the height H of the microstructure is 100-500 μm, the width D is 50 μm, and the thickness is 50 μm-200 μm. The inclination angle θ between the array structure and the substrate surface is 30° to 45°, and the array spacing W is 400 μm to 800 μm. According to the design structure, draw a two-dimensional diagram of the microstructure path of wire electric discharge machining;

[0039] Step 2. Import the 2D image, and perform WEDM processing twice:

[0040] The first wire electric discharge cutting: on the surface of the NiTi shape memory alloy substrate 2 clamped horizontally, according to figure 1 The wire-cu...

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Abstract

The invention discloses a preparation method of a self-heat-absorption reshaping ice extension / deicing microarray structure, and belongs to the technical field of micro-nano structure functional surface preparation. The blade-like array microstructure with the inclination angle of 30-45 degrees is prepared on the shape memory alloy, and the graphene photo-thermal coating grows on the surface of the blade-like array microstructure. After the graphene photo-thermal coating is irradiated by sunlight, a large amount of heat is generated on the surface through photo-thermal conversion, the local temperature is rapidly increased, in a low-temperature environment, the shape memory alloy coated with ice on the surface recovers to be in a high-temperature state with a large micro-structure inclination angle after being heated, an ice layer attached to the surface is promoted to fall off, and therefore the graphene photo-thermal coating is formed. And the active anti-icing and deicing process of the material surface is realized. The microstructure machined by adopting wire cut electrical discharge machining is good in shape recovery after deformation. The directional rolling of the liquid drops can be realized by regulating and controlling the form of the array microstructure, so that subsequent deicing is facilitated; the prepared microstructure can reduce the contact area between ice and the substrate so as to reduce the adhesion strength of the ice on the material surface.

Description

technical field [0001] The invention belongs to the technical field of micro-nano structure functional surface preparation, and in particular relates to a preparation method of a self-absorbing and reshapeable ice-extending / de-icing microarray structure. Background technique [0002] Icing phenomena commonly exist in nature. Icing on the surface of materials will increase the load of components, change the surface morphology and surface characteristics of components, affect the safety, reliability and work efficiency of equipment operation, and bring serious harm to production and life. Common anti-icing methods are divided into active and passive anti-icing, passive anti-icing mainly consists of mechanical, heating and chemical anti-icing methods. These methods not only consume material and energy, but even destroy the base material. Active anti-icing means that no external energy is consumed to achieve the anti-icing effect, usually by roughening the structure and obtaini...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00B23H7/02B23H9/00B08B3/12
CPCB23P15/00B23H7/02B23H9/00B08B3/12
Inventor 弯艳玲王湘涵许金凯廉中旭王永华侯永刚任万飞
Owner CHANGCHUN UNIV OF SCI & TECH
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