Reflow soldering jig for flexible circuit board

Abstract

The invention discloses a reflow soldering jig for a flexible circuit board, which is applied to a reflow soldering process of a PET (Polyethylene Terephthalate)-based film flexible circuit board and comprises a cover plate and a support bottom, and the cover plate and the support bottom are respectively positioned on the front side and the back side of the flexible circuit board; the cover plate is provided with at least one group of hollow holes for welding; the surface of the cover plate is coated with heat insulation paper to form a first heat insulation layer; the surface of the support bottom is wrapped with heat insulation paper to form a second heat insulation layer, and during welding, the first heat insulation layer and the second heat insulation layer are directly attached and extruded to the front face and the back face of the flexible circuit board; the first heat insulation layer and the second heat insulation layer are tightly attached to the flexible circuit board, the hollow hole is heated to complete machining of the welding position, effective heat insulation is carried out on the flexible circuit board in the welding process, heat is concentrated at the welding position and cannot be dissipated to the periphery, and the welding quality is improved. And therefore, the flatness of the flexible circuit board taking the PET as the base film is ensured, the deformation is avoided, and the problems in the prior art are solved.

Description

technical field [0001] The invention relates to the field of reflow soldering fixtures, in particular to a reflow soldering fixture for a flexible circuit board. Background technique [0002] Flexible circuit board is a highly reliable and excellent flexible circuit made of polyimide or polyester film through die-cutting process, because it can be freely bent, folded, rolled It can move and stretch freely in three-dimensional space, so as to achieve the integration of component assembly and wire connection. [0003] In the process of producing flexible circuit boards, the circuit assembly and connection technology needs to be soldered and assembled by reflow soldering after SMT patching of the base film, and jigs are needed to assist in the accurate positioning of high-temperature solder paste Welding; and polyester film PET has the advantages of high insulation and low price, which is attracting more and more manufacturers to try to use PET as the base material to produce ...

AI Technical Summary

Problems solved by technology

[0003] In the process of producing flexible circuit boards, the circuit assembly and connection technology needs to be soldered and assembled by reflow soldering after SMT patching of the base film, and jigs are needed to assist in the accurate positioning of high-temperature solder paste Welding; and polyester film PET has the advantages of high insulation and low price, which is attracting more and more manufacturers to try to use PET as the base material to produce flexible circuit boards, but the temperature resistance of PET base material is only 180 ℃, use the melting temperature of 235-250 ℃ in the reflow soldering process of high temperature solder paste, most of the existing reflow soldering fixtures include a cover plate and a supporting plate, and the cover plate and the supporting plate are fastened together, and The cover plate is provided with welding holes, which are used to accurately melt the high-temperature solder paste and realize welding with the metal sheet. However, since the PET substrate is directly attached to the middle of the cover plate and the supporting plate, the cover plate Most of them are made of metal. During the welding process, the heat is dissipated to the cover plate and the supporting plate, so that the PET base film is deformed at high temperature due to the heat shrinkage effect, and the flexible circuit board is damaged. The main cause of damage is the deformation caused by high temperature. And the product becomes brittle; therefore, a new type of reflow soldering fixture is urgently needed, which is suitable for PET as a base film for the preparation of flexible die-cut circuit boards

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