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PCB and pressing method thereof

A substrate and prepreg technology, applied in multilayer circuit manufacturing, printed circuit components, etc., can solve problems such as low production efficiency, production pollution, and large interlayer deviation, so as to improve production efficiency, avoid processes, and reduce lamination layers. biased effect

Pending Publication Date: 2022-04-12
广东和鑫达电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a PCB and its lamination method to solve the technical problems of large interlayer deviation, low production efficiency and serious production pollution in the existing PCB lamination method

Method used

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  • PCB and pressing method thereof
  • PCB and pressing method thereof

Examples

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no. 1 example

[0047] Please refer to attached figure 2 , attached image 3 And attached Image 6 , the present invention provides a PCB and its pressing method, comprising the following steps:

[0048] S01: Cut the two substrates 300 into a predetermined size, and perform inner layer patterning on the substrates 300 .

[0049] S02: Use an automatic optical inspection machine to detect and repair the open circuit, short circuit, gap and residual copper of the substrate 300 .

[0050] Specifically, S02 includes the following steps:

[0051]S21: Use the LDI exposure machine to transfer and fabricate the inner layer pattern, and control the layer deviation of the inner layer within 20 microns. Wherein, pattern transfer refers to the pattern transfer of the photographic master plate to the copper-clad foil substrate. In addition, the layer deviation control of the inner layer can be realized by setting the layer deviation accuracy of the LDI exposure machine, and other processes of the inn...

no. 2 example

[0067] Please refer to the attached Figure 4 , attached Figure 5 And attached Image 6 , the present invention provides a PCB and its pressing method, comprising the following steps:

[0068] S01: Cut the two substrates 300 into a predetermined size, and perform inner layer patterning on the substrates 300 .

[0069] S02: Use an automatic optical inspection machine to detect and repair the open circuit, short circuit, gap and residual copper of the substrate 300 .

[0070] Specifically, S02 includes the following steps:

[0071] S21: Use the LDI exposure machine to transfer and fabricate the inner layer pattern, and control the layer deviation of the inner layer within 20 microns. In addition, the layer deviation control of the inner layer can be realized by setting the layer deviation accuracy of the LDI exposure machine, and other processes of the inner layer are processed according to the control method of the multilayer board.

[0072] S03 : Punching the substrate 3...

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Abstract

The invention relates to the technical field of printed circuit boards, in particular to a PCB and a pressing method thereof. The invention provides a pressing method of a PCB. The pressing method comprises the following steps of S01, cutting a substrate into a preset size, and performing inner layer pattern manufacturing on the substrate; s02, detecting and repairing the substrate by adopting an automatic optical detector; s03, performing hot melting positioning hole punching on the substrate; s04, carrying out browning treatment on the substrate; s05, cutting the first prepreg, and drilling; s06, placing the first prepreg between the substrates and carrying out hot melting; s07, a second prepreg is pre-stacked outside each of the two layers of substrates; s08, cutting the copper foil; s09, typesetting the copper foil, the second prepreg and the substrate; and S10, carrying out press fit. The invention provides a PCB (printed circuit board) and a laminating method thereof, which are used for solving the technical problems of large interposer deviation, low production efficiency and serious production pollution in the existing PCB laminating mode.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a PCB and a pressing method thereof. Background technique [0002] In the printed circuit board manufacturing industry, printed circuit boards are mainly divided into single-sided boards, double-sided boards and multi-layer boards according to their structural classification. Printed circuit board multilayer boards are divided into four-layer boards, six-layer boards, eight-layer boards, ten-layer boards and higher-level products; among them, when ordinary multi-layer boards are greater than or equal to six-layer boards, they are stacked by multiple core boards. Therefore, when the number of layers is greater than or equal to six layers, multiple core boards are required to be superimposed, and the design of the lamination structure of some products requires that the thickness of the dielectric layer between the inner core board and the inner core board be greater ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02
Inventor 陈占波张军
Owner 广东和鑫达电子股份有限公司
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