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A packaging structure of igbt module with automatic temperature control

A temperature control and module packaging technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as heat dissipation bottlenecks, solve heat dissipation bottlenecks, achieve precise control and rapid cooling, improve reliability and The effect of the service life

Active Publication Date: 2022-05-24
合肥阿基米德电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an automatic temperature control IGBT module packaging structure to solve the heat dissipation bottleneck problem of the IGBT module TIM in the prior art, and at the same time realize precise control of chip temperature and rapid cooling

Method used

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  • A packaging structure of igbt module with automatic temperature control
  • A packaging structure of igbt module with automatic temperature control
  • A packaging structure of igbt module with automatic temperature control

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] The purpose of the present invention is to provide an IGBT module package structure with automatic temperature control, which is used to solve the TIM heat dissipation bottleneck problem of the IGBT module in the prior art, and simultaneously realize precise control of chip temperature and rapid cooling.

[0026] In order to make the above objects, features and advantages of the present invention more clearly understood, the pre...

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Abstract

The invention discloses an automatic temperature control IGBT module packaging structure, comprising: a heat sink, a TIM, a copper substrate, a solder layer and a copper-clad ceramic substrate arranged sequentially from bottom to top; the copper-clad ceramic substrate is also provided with a diode and the IGBT chip; the heat sink, the TIM, the copper substrate, the solder layer and the copper-clad ceramic substrate are penetrated with micro-channels; the copper-clad ceramic substrate, the copper substrate, the thermal The sink and the microchannel constitute a solid-liquid-gas three-phase cooling system. The invention can greatly improve the performance of the cooling system of the IGBT module, does not require an external liquid pump, can solve the TIM cooling bottleneck problem of the IGBT module in the prior art, and simultaneously realizes precise control of the chip temperature and rapid cooling, thereby improving the reliability and service life of the device .

Description

technical field [0001] The invention relates to the technical field of power electronic chip manufacturing and packaging and testing, in particular to an IGBT module packaging structure with automatic temperature control. Background technique [0002] As one of the core devices for energy conversion and transmission, high-power IGBT devices are widely used in traction, electric vehicles, power transmission and other fields. The heat is further concentrated, and the conventional heat conduction technology can no longer achieve effective heat conduction, and the heat generated by dissipation seriously threatens the operational reliability of electronic equipment. [0003] Thermal management of power electronic devices refers to the realization of high heat dissipation performance of devices through efficient heat dissipation technology and reasonable structural design. The laminated structure of IGBT devices is relatively complex, the thermal resistance chain is long, and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/46H01L23/427H01L25/18
Inventor 周洋孙亚萌马坤宋一凡
Owner 合肥阿基米德电子科技有限公司
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