Phase change suppression radiator of 3D cavity structure, preparation method and electronic equipment

Abstract

The invention provides a phase change suppression radiator based on a 3D cavity structure, a preparation method and electronic equipment, the radiator structure comprises a bottom plate, a top plate, a plurality of middle plates located between the top plate and the bottom plate and cooling fins located on the middle plates, the bottom plate is provided with a first channel and a second channel, the top plate is at least provided with a third channel, and the first channel is communicated with the second channel. The middle plate is provided with a connecting channel, and the connecting channel is at least connected with the first channel, the second channel and the third channel to form a closed 3D cavity. By introducing and designing the bottom plate, the middle plate and the top plate and arranging the radiating pipelines on the bottom plate, the top plate and the middle plate, the phase change suppression radiator of the 3D cavity structure is obtained, temperature equalization of the radiator is facilitated, the radiating capacity and the radiating efficiency of the radiator are improved, and the service life of the radiator is prolonged. The heat dissipation bottleneck problem caused by heat in power devices such as a high-heat-flow and high-power IGBT is solved.

Description

technical field [0001] The invention belongs to the technical field of heat transfer, and in particular relates to a phase-change suppression radiator based on a 3D three-dimensional cavity structure, a preparation method and an electronic device. Background technique [0002] With the rapid development of power electronics technology, the integration of power components is getting higher and higher, and the power density is also getting higher and higher, and the heat generated by itself during operation is also increasing. The removal of heat will cause the temperature of the chips in the power devices to increase, which will reduce the efficiency and shorten the service life, and will lead to the failure of the power devices and the burning of the chips. An efficient and reliable heat sink is to ensure the reliability of these power devices. an important part of running. [0003] High-power IGBT devices have higher and higher requirements for heat dissipation. Traditiona...

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Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a phase change suppression heat sink based on a 3D three-dimensional cavity structure, a preparation method and an electronic device, which are used to solve the problem of high-power devices in the prior art that are difficult to effectively dissipate heat, Difficult to achieve effective temperature equalization effect and limited size and cost

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