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High-power-density integrated active phased-array antenna microsystem

A high power density, phased array antenna technology, applied in antenna grounding device, antenna grounding switch structure connection, antenna support/mounting device, etc., can solve heat density concentration, antenna system performance degradation, unable to meet the use requirements, etc. problems, to achieve the effect of ensuring work performance, solving heat dissipation bottlenecks, and good work performance

Active Publication Date: 2022-06-07
BEIJING INST OF REMOTE SENSING EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although both methods achieve lightweight and integrated design, it is difficult to meet the requirements of high power density work. After high-density integration of high-power phased array antenna systems, severe heat density concentration problems will occur, resulting in performance degradation of the antenna system. In the end, it cannot meet the needs of use

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Embodiment Construction

[0044]In the following will refer to the accompanying drawings to describe more fully the exemplary embodiments, but the exemplary embodiments may be embodied in different forms and should not be construed as limited to the embodiments described herein. Conversely, the object of providing these embodiments is to make the present invention thorough and complete, and those skilled in the art fully understand the scope of the present invention.

[0045] Without conflict, embodiments of the present invention and the features in the embodiments may be combined with each other.

[0046] As used herein, the term "and / or" includes any and all combinations of one or more related enumerated entries.

[0047] The terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention. As used in the present invention, the singular forms "a" and "the" are also intended to include plural forms, unless the context is otherwise clearly indicated. I...

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Abstract

The invention provides a high-power-density integrated active phased-array antenna microsystem which is applied to a high-power-density scene and comprises an antenna unit, a high-power chip, high-temperature co-fired ceramic, a multifunctional chip, a graphene film, a first support assembly and a second support assembly. The antenna unit is welded to the upper surface of the high-power chip, the high-power chip is welded to the upper surface of the high-temperature co-fired ceramic, the graphene film is bonded to the lower surface of the multifunctional chip, the high-temperature co-fired ceramic is welded to the first support assembly, the first support assembly is connected with the second support assembly, and the graphene film is bonded to the second support assembly. The heat of the high-power chip is conducted to the high-temperature co-fired ceramic, is conducted to the first bracket assembly by the high-temperature co-fired ceramic and then is conducted to the cold end; heat of the high-power chip is conducted to the antenna unit; heat of the multifunctional chip is conducted to the graphene film, is conducted to the second support assembly through the graphene film and then is conducted to the cold end. And the heat dissipation bottleneck problem of the high-power-density integrated active phased-array antenna is solved.

Description

Technical field [0001] The present invention relates to a phased array antenna microsystem, in particular a high power density integrated active phased array antenna microsystem. Background [0002] In the field of communication electronics, phased array technology has become the mainstream technology of electronic communication development due to its multiple advanced technical advantages, especially in radar, 5G communication, satellite communication and other aspects have been widely used. As the core of the phased array system, the traditional antenna system is mostly built of discrete modules, and with the requirements of miniaturization and lightweighting, this method can no longer meet the application requirements. [0003] High-density integrated phased array antenna is a new type of phased array antenna technology, which adopts integrated and lightweight design ideas to integrate the high-density integration of various components in the system to achieve the integrated d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/12H01Q1/02H01Q1/38H01Q1/48H01Q1/50
CPCH01Q1/12H01Q1/02H01Q1/38H01Q1/48H01Q1/50Y02D30/70
Inventor 刘涓韩春晖刘海鹏
Owner BEIJING INST OF REMOTE SENSING EQUIP
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