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A spray-enhanced radiator

A heat sink and heat dissipation substrate technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of blocked flow of coolant, increased processing difficulty, increased pressure loss, etc., to achieve The effect of eliminating flow resistance restriction, low processing cost, and increasing heat transfer capacity

Active Publication Date: 2021-07-27
JIHUA LAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of design generally causes the following problems: due to the sharp increase in the heat flux density of the heating element, the radiator will also be forced to seek a larger heat dissipation area to meet the heat dissipation requirements, which will inevitably increase the number of fins, increase the length of the fins, and reduce the heat dissipation. The thickness of the ribs is thicker, and the spacing between the ribs is reduced, so the difficulty of processing is bound to increase, and the cost is bound to increase. After the spacing of the fins is reduced, the flow of coolant is blocked, and the pressure loss is bound to increase.

Method used

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  • A spray-enhanced radiator
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Embodiment Construction

[0024] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0025] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating ...

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Abstract

The invention provides a spray-enhanced radiator, which comprises a spray control cavity with an upper opening, a heat dissipation substrate covered at the upper opening of the spray control cavity, a spray device arranged at the lower part of the spray control cavity, and a The device is a high-pressure delivery device for delivering high-pressure coolant; the injection device is used to make the high-pressure coolant spray upward to form a high-pressure spray; the upper surface of the heat dissipation substrate is used to arrange heating elements. The heat sink can effectively dissipate heat to the heating element with high flow density, and has a relatively simple structure, low manufacturing difficulty and low processing cost.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a spray-enhanced radiator. Background technique [0002] At present, high-power electronic equipment components typically represented by supercomputing CPUs or high-power power supply IGBT components have shown a polarized trend of maximizing power loads and minimizing component sizes. The performance of various electronic components in electronic equipment Getting stronger and stronger. At the same time, within the limited volume space, the integration density of these electronic components in the equipment or in the PCB board is getting higher and higher. In the future, the power of these high-precision, high-power devices will continue to increase, the heat consumption of the entire device will also range from tens of kilowatts to megawatts, and the heat generation of its core electronic components will also range from several thousand watts to tens of kilowatts. Wait. Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272
Inventor 黄星星胡强侯立涛徐平胡琅冯杰黎天韵尤晶
Owner JIHUA LAB
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